公开(公告)号：AU2003297348A1

公开(公告)日：2004-07-29

申请号：AU2003297348

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ZHANG JIE ,  GAMOTA DANIEL ,  ZHANG MIN-XIAN ,  BRAZIS PAUL ,  KALYANASUNDARAM KRISHNA

IPC: H01L51/00 ,  H01L51/30 ,  H01L51/40

公开(公告)号：AU9055801A

公开(公告)日：2002-03-04

申请号：AU9055801

申请日：2001-08-22

Applicant: MOTOROLA INC

Inventor： ESTES KURT ,  PAL DEBABRATA ,  MCDUNN KEVIN ,  SHMAGIN IRINA ,  GAMOTA DANIEL

IPC: H01L23/38 ,  H01L23/427 ,  H01L35/00 ,  H02N3/00

Abstract: Battery life and cooling are improved in an electronic device. A thermoelectric module and phase change material module are placed near a heat source in an electronic device. The thermoelectric module and phase change material module insulate a surface to be cooled on the electronic device. The thermoelectric module generates an electrical current in response to a temperature differential at opposite surfaces on the thermoelectric module. The phase change material module enhances or limits the temperature differential seen at the thermoelectric module. The electrical current generated by the thermoelectric module is used to charge a battery of the electronic device.

公开(公告)号：AU2003268514A8

公开(公告)日：2004-03-29

申请号：AU2003268514

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： KALYANASUNDARAM KRISHNA ,  BRAZIS PAUL ,  CHASON MARC ,  GAMOTA DANIEL

IPC: H01L21/78 ,  H01L20060101 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/76 ,  H01L23/538 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

公开(公告)号：AU2003268514A1

公开(公告)日：2004-03-29

申请号：AU2003268514

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： BRAZIS PAUL ,  CHASON MARC ,  KALYANASUNDARAM KRISHNA ,  GAMOTA DANIEL

IPC: H01L20060101 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/76 ,  H01L21/78 ,  H01L23/538

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

公开(公告)号：ES2459746T3

公开(公告)日：2014-05-12

申请号：ES01970566

申请日：2001-08-22

Applicant: MOTOROLA INC ,  MOTOROLA MOBILITY LLC

Inventor： ESTES KURT ,  PAL DEBABRATA ,  MCDUNN KEVIN ,  SHMAGIN IRINA ,  GAMOTA DANIEL

IPC: H02N3/00 ,  H01L23/38 ,  H01L23/427 ,  H01L35/00

Abstract: Un dispositivo electrónico (300) incluyendo un circuito electrónico (102, 104); un módulo termoeléctrico (106); y un material de cambio de fase acoplado al módulo termoeléctrico, caracterizándose el dispositivo electrónico porque: el material de cambio de fase se coloca junto al circuito electrónico para absorber y almacenar calor del circuito electrónico (102, 104), y el módulo termoeléctrico (106) tiene una superficie adyacente a un lado del material de cambio de fase de tal manera que la temperatura de una superficie sea aproximadamente la temperatura del lado del material de cambio de fase, y una superficie opuesta cerca de una superficie externa del dispositivo electrónico (300).

公开(公告)号：AU2003258965A8

公开(公告)日：2004-01-23

申请号：AU2003258965

申请日：2003-06-26

Applicant: MOTOROLA INC

Inventor： GAMOTA DANIEL ,  ZHANG JIE ,  CHOWDHURI ABHIJIT ROY ,  SCHEIFERS STEVEN ,  KALYANASUNDARAM KRISHNA ,  BRAZIS PAUL ,  WIELGUS JERZY

IPC: H01L21/00 ,  H01L35/24 ,  H01L51/00 ,  H01L51/40

Abstract: An organic field effect transistor utilizes a bifunctional contact-enhancing agent at various interfaces to improve carrier mobility through the organic semiconductor layer, to improve carrier injection, and to enhance adhesion via a bifunctional mechanism. The contact-enhancing agent can be situated between the gate electrode (2) and the dielectric layer (3) to form a chemical or physical bond between the gate electrode and the dielectric layer. It can also be situated between the dielectric layer and the organic semiconducting layer (4), or between the source and drain electrodes (5, 6) and the organic semiconducting layer.

公开(公告)号：AU2002356062A1

公开(公告)日：2003-03-03

申请号：AU2002356062

申请日：2002-07-13

Applicant: MOTOROLA INC

Inventor： TUNGARE AROON ,  GAMOTA DANIEL ,  SKIPOR ANDREW ,  GHAEM SANJAR ,  CHASON MARC

IPC: B81B3/00 ,  H01H59/00 ,  H05K3/40 ,  B81B7/00 ,  B81C1/00

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

公开(公告)号：AU1219001A

公开(公告)日：2001-04-30

申请号：AU1219001

申请日：2000-10-19

Applicant: MOTOROLA INC

Inventor： BURROUGHS JOHN A ,  GAMOTA DANIEL ,  NORTON JEFFREY J ,  WREZEL JAMES A

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/82 ,  H01L23/52 ,  H01L29/40

公开(公告)号：WO02080229A3

公开(公告)日：2003-04-17

申请号：PCT/US0205431

申请日：2002-02-22

Applicant: MOTOROLA INC

Inventor： SCHEIFERS STEVEN M ,  SKIPOR ANDREW ,  GAMOTA DANIEL

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/06 ,  H01L23/28 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A microelectronic assembly (6) includes a substrate (22) having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die (12) having a die face and a plurality of bond pads of the die (12) face. The die is provided with a polymeric bead (32) about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead (32) to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate (22).

Abstract translation: 微电子组件（6）包括：衬底（22），其具有设置在基本上平坦的管芯附接表面上的多个接合焊盘;以及集成电路管芯（12），其具有管芯面和管芯（12）的多个接合焊盘， 面对。 模具设置有围绕模具的外边缘的聚合物珠粒（32）。 模面接合焊盘与相应的衬底接合焊盘对准，并通过加热电连接到回流温度。 聚合物珠粒（32）暴露于回流温度导致珠粒在模头和基底（22）之间形成周边粘结。

公开(公告)号：WO2004095511A2

公开(公告)日：2004-11-04

申请号：PCT/US2004010776

申请日：2004-04-08

Applicant: MOTOROLA INC ,  ADEWOLE HAKEEM ,  BRAZIS PAUL ,  GAMOTA DANIEL ,  ZHANG JIE

Inventor： ADEWOLE HAKEEM ,  BRAZIS PAUL ,  GAMOTA DANIEL ,  ZHANG JIE

IPC: G06F19/00 ,  H01L20060101 ,  H01L

CPC classification number: G06K19/0723 ,  G06K19/0717 ,  G06K19/07703

Abstract: An organic semiconductor product state monitor attached to a product receives a product usefulness input, which, along with the product predetermined usefulness limit, is used to determine an indicator command to indicate a state of usefulness of the product. An organic circuit is formed and placed on a product with a power supply to control the circuit operation.

Abstract translation: 附加到产品的有机半导体产品状态监视器接收产品有用性输入，其与产品预定有用限制一起用于确定指示产品有用状态的指示符命令。 形成有机电路并放置在具有电源的产品上以控制电路操作。