公开(公告)号：AU2002359885A1

公开(公告)日：2003-07-30

申请号：AU2002359885

申请日：2002-12-31

Applicant: MOTOROLA INC

Inventor： CHASON MARC ,  DANVIR JANICE ,  QI JING ,  YALA NADIA

IPC: H01L21/56 ,  H01L23/31 ,  H05K3/34

公开(公告)号：AU2003265969A1

公开(公告)日：2004-04-30

申请号：AU2003265969

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： DANVIR JANICE ,  HAN ZHAOJIN ,  KULKARNI PRASANNA ,  YALA NADIA ,  DOOT ROBERT ,  QI JING

IPC: H01L21/60 ,  H01L21/66 ,  H01L23/544 ,  H05K1/02 ,  H05K3/34 ,  H01L31/072 ,  H01L31/109

Abstract: A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.

公开(公告)号：WO2004071140A2

公开(公告)日：2004-08-19

申请号：PCT/US2004002615

申请日：2004-01-30

Applicant: MOTOROLA INC ,  DANVIR JANICE ,  DEVANIE KATHERINE ,  YALA NADIA

Inventor： DANVIR JANICE ,  DEVANIE KATHERINE ,  YALA NADIA

IPC: H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  H05K

CPC classification number: H05K3/305 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/3015 ,  H01L2224/30155 ,  H01L2224/32058 ,  H01L2224/73103 ,  H01L2224/73203 ,  H05K3/3436 ,  H05K7/1053 ,  H05K2201/0129 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0191 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Abstract translation: 自支撑底部填充膜（18）将表面贴装集成电路封装（14）粘合地粘合到印刷电路板（10）上。 印刷电路板在表面上具有导电迹线（12）和暴露的导电焊盘（13）。 薄膜粘合剂在导电焊盘附近在印刷电路板上有策略地定位，然后将表面贴装集成电路封装放置在板上，使得封装上的导电焊盘（16）与板上的导电焊盘对准。 当封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充物以增加焊点的机械完整性。