公开(公告)号：WO1994023555A1

公开(公告)日：1994-10-13

申请号：PCT/US1994002777

申请日：1994-03-17

Applicant: MOTOROLA INC.

Inventor： MOTOROLA INC. ,  MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: H05K03/34

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

Abstract translation: 在电子封装中，用于接合引线表面（31,40）的焊料连接（14）由包含第三金属，优选金或银的锡 - 铋合金形成，其量有效地增加合金的熔化温度， 在运行中通常遇到的升高的温度下增强连接的机械性能。 用于形成焊料连接的工艺包括将第三金属的膜（36）施加到至少一个引线表面（31）上，然后将锡 - 铋焊膏（38）施加到膜上。 优选地，将锡 - 铋合金的板（26）首先电镀在其上镀有第三金属的引线表面（31）上。 在加热回流焊料期间，第三金属溶解以产生形成连接的均匀液体。

公开(公告)号：EP0643903B1

公开(公告)日：1997-08-06

申请号：EP94912785.6

申请日：1994-03-17

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: H05K3/34 ,  B23K35/26

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

公开(公告)号：EP0643903A1

公开(公告)日：1995-03-22

申请号：EP94912785.0

申请日：1994-03-17

Applicant: MOTOROLA, INC.

Inventor： MELTON, Cynthia ,  FUERHAUPTER, Harry ,  DEMET, George

IPC: B23K35 ,  H05K3

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3473 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  Y02P70/611

Abstract: In an electronic package, a solder connection (14) for bonding faying surfaces (31, 40) is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film (36) of the tertiary metal onto at least one faying surface (31) and thereafter applying tin-bismuth solder paste (38) onto the film. Preferably, a plate (26) of tin-bismuth alloy is first electroplated onto the faying surface (31), onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.