Abstract:
A surface mount component placement arrangement includes a circuit supporting substrate (202) having a first surface (308), and disposed thereon are a first pad array (502) and a first at least one aligning pad (506). A component (802) has a second surface (801), the second surface (801) substantially opposing the first surface (308), and disposed on the second surface (801) are second pad array (406) and a second at least one aligning pad (508). The first and second pad arrays (406, 502) at least partially overlap with each other. The aligning pads (506, 508) at least partially overlap with each other relative to a second tolerance of the placement operation. The partially overlapping pair of pads (506, 508) are oriented relative to each other such that when solder therebetween is liquid the surface tension of the solder can move the component (802) relative to the circuit supporting substrate.
Abstract:
A method for receiving a registration status indication at a one-way roaming selective call receiver comprises the steps of scanning (1051) a predetermined set of frequencies for an identifier(s) (1052 or 1056) broadcast on the frequencies that match identifier(s) stored at the receiver. The method provides an indication of being registered in a "home" zone (1054) if an identifier transmitted on the communication resource matches a "home" zone identifier stored in the receiver or provides for an indication of being registered in a "roaming" zone (1058) if an identifier transmitted on the frequencies matches a "roaming" zone identifier stored in the receiver or provides for an indication of not being registered (1055 or 1059) when the identifier transmitted on the frequencies do(es) not match either the "home" zone identifier or the "roaming" zone identifier stored in the receiver.
Abstract:
A surface mount component placement arrangement includes a circuit supporting substrate (202) having a first surface (308), and disposed thereon are a first pad array (502) and a first at least one aligning pad (506). A component (802) has a second surface (801), the second surface (801) substantially opposing the first surface (308), and disposed on the second surface (801) are second pad array (406) and a second at least one aligning pad (508). The first and second pad arrays (406, 502) at least partially overlap with each other. The aligning pads (506, 508) at least partially overlap with each other relative to a second tolerance of the placement operation. The partially overlapping pair of pads (506, 508) are oriented relative to each other such that when solder therebetween is liquid the surface tension of the solder can move the component (802) relative to the circuit supporting substrate.