Abstract:
The invention relates to a charged particle lithography apparatus (100) with a charged particle source (101) for creating one or more charged particle beams (123), a charged particle projector (108, 109, 110) for projecting the beams onto a wafer; and a moveable wafer stage (132) for carrying the wafer (130). The charged particle source, charged particle projector, and moveable wafer stage are disposed in a common vacuum chamber (140) forming a vacuum environment. The vacuum chamber further has an opening for loading wafers into the chamber and a door.
Abstract:
An arrangement comprising a plurality of charged particle lithography apparatuses, each charged particle lithography apparatus having a vacuum chamber (400). The arrangement further comprises a common robot (305) for conveying wafers to the plurality of lithography apparatuses, and a wafer load unit (303) for each charged particle lithography apparatus arranged at a front side of each respective vacuum chamber (400). The plurality of lithography apparatuses are arranged in a row with the front side of the lithography apparatuses facing an aisle (310) accommodating passage of the common robot (305) for conveying wafers to each apparatus, and the rear side of each lithography apparatus faces an access corridor (306), and the back wall of each vacuum chamber is provided with an access door for access to the respective lithography apparatus.
Abstract:
The invention relates to a method of realizing a vacuum in a vacuum chamber (400). The vacuum chamber is connected to a pumping system (300) shared by a plurality of vacuum chambers. The method includes separately pumping down each vacuum chamber. The invention further relates to an arrangement of a plurality of vacuum chambers connected to a pumping system. In this arrangement, the pumping system is arranged for pumping down each vacuum chamber separately.
Abstract:
A vacuum chamber (400) comprising a plurality of wall panels (510) enclosing an interior space, in which the wall panels are removably attached to form the chamber using a plurality of connection members (504, 524, 528) for locating the wall panels in a predetermined arrangement. The vacuum chamber further comprises one or more sealing members (522) provided at the edges of the wall panels. The wall panels are arranged so that a vacuum tight seal is formed at the edges of the wall panels as a result of forming a vacuum in the interior space.
Abstract:
A vacuum chamber (400) comprising a plurality of wall panels (510) enclosing an interior space, in which the wall panels are removably attached to form the chamber using a plurality of connection members (504, 524, 528) for locating the wall panels in a predetermined arrangement. The vacuum chamber further comprises one or more sealing members (522) provided at the edges of the wall panels. The wall panels are arranged so that a vacuum tight seal is formed at the edges of the wall panels as a result of forming a vacuum in the interior space.
Abstract:
The invention relates to a method of realizing a vacuum in a vacuum chamber (400). The vacuum chamber is connected to a pumping system (300) shared by a plurality of vacuum chambers. The method includes separately pumping down each vacuum chamber. The invention further relates to an arrangement of a plurality of vacuum chambers connected to a pumping system. In this arrangement, the pumping system is arranged for pumping down each vacuum chamber separately.
Abstract:
The invention relates to a charged particle lithography apparatus (100) with a charged particle source (101) for creating one or more charged particle beams (123), a charged particle projector (108, 109, 110) for projecting the beams onto a wafer; and a moveable wafer stage (132) for carrying the wafer (130). The charged particle source, charged particle projector, and moveable wafer stage are disposed in a common vacuum chamber (140) forming a vacuum environment. The vacuum chamber further has an opening for loading wafers into the chamber and a door.