公开(公告)号：US20010040250A1

公开(公告)日：2001-11-15

申请号：US09858092

申请日：2001-05-15

Applicant: Memscap

Inventor： Catherine Charrier ,  Eric Bouchon ,  Alain Campo ,  Guy Imbert ,  Francois Valentin ,  Laurent Basteres

IPC: H01L021/8234

CPC classification number: B81C1/00158 ,  B81B3/007 ,  B81B2201/018 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/033 ,  B81C2201/0109 ,  B81C2201/0197 ,  H01G5/16 ,  H01H1/0036

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1); removing the sacrificial resin layer (15).

Abstract translation: 用于制造可变电容器或微型开关类型的电子部件的方法包括彼此相对定位的固定板（1）和可变形膜（20），其包括以下步骤：将第一金属层沉积在 氧化物层（2），所述第一金属层旨在形成所述固定板; 在固定板（1）的周边的至少一部分和每一侧上沉积金属带（10,11），所述带旨在用作固定板（1）和可变形膜（20）之间的间隔件 ）; 在所述固定板（1）的至少所述区域上沉积牺牲树脂层（15）; 通过光刻产生在所述牺牲树脂层的表面中的多个孔; 通过电解在形成在牺牲树脂（15）中的阱内沉积旨在形成可变形膜（20）的至少一个金属区域，该金属区域在位于金属带（10,11）的部分之间延伸 在所述固定板（1）的每一侧上; 去除牺牲树脂层（15）。

公开(公告)号：US20020186114A1

公开(公告)日：2002-12-12

申请号：US10206284

申请日：2002-07-26

Applicant: Memscap

Inventor： Laurent Basteres ,  Ahmed Mhani ,  Francois Valentin ,  Jean-Michel Karam

IPC: H01F005/00

CPC classification number: H01F17/0006 ,  H01F2017/0046 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inductive component (1), especially intended to be incorporated into a radiofrequency circuit, comprising: a substrate layer (2); a flat inductor formed from a metal strip (3) wound in a spiral; wherein: the substrate layer (2) is made of quartz; the metal strip (3) is made of copper and has a thickness (E3) of greater than 10 microns.

Abstract translation: 一种特别旨在并入射频电路中的电感元件（1），包括：衬底层（2）; 由螺旋缠绕的金属条（3）形成的扁平电感器; 其中：所述基底层（2）由石英制成; 金属条（3）由铜制成并且具有大于10微米的厚度（E3）。

公开(公告)号：US20020160576A1

公开(公告)日：2002-10-31

申请号：US10177435

申请日：2002-06-21

Applicant: Memscap S.A.

Inventor： Laurent Basteres ,  Ahmed Mhani ,  Francois Valentin ,  Jean-Michel Karam

IPC: H01L021/20

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising: a semiconductor substrate layer (2); a passivation layer (4) covering the substrate layer (2); metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4); which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).

Abstract translation: 一种结合电感元件（2）的单体集成电路（1），包括：半导体衬底层（2）; 覆盖衬底层（2）的钝化层（4）; 金属接触焊盘（5），其连接到衬底（2）并通过钝化层（4）以与钝化层（4）的上表面（6）齐平; 该电路还包括形成电感器并且位于平行于钝化层（4）的上表面（6）的平面中的螺旋绕组（20），所述绕组（20）由铜匝（21-23,27） ，28），所述绕组端形成在所述绕组（20）的平面下方延伸并延伸到所述接触焊盘（5）的延伸部（12）。

公开(公告)号：US20020132387A1

公开(公告)日：2002-09-19

申请号：US10151744

申请日：2002-05-20

Applicant: Memscap

Inventor： Catherine Charrier ,  Eric Bouchon ,  Alain Campo ,  Guy Imbert ,  Francois Valentin ,  Laurent Basteres

IPC: H01L021/00

CPC classification number: B81C1/00158 ,  B81B3/007 ,  B81B2201/018 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/033 ,  B81C2201/0109 ,  B81C2201/0197 ,  H01G5/16 ,  H01H1/0036

Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1); removing the sacrificial resin layer (15).

Abstract translation: 用于制造可变电容器或微型开关类型的电子部件的方法包括彼此相对定位的固定板（1）和可变形膜（20），其包括以下步骤：将第一金属层沉积在 氧化物层（2），所述第一金属层旨在形成所述固定板; 在固定板（1）的周边的至少一部分和每一侧上沉积金属带（10,11），所述带旨在用作固定板（1）和可变形膜（20）之间的间隔件 ）; 在所述固定板（1）的至少所述区域上沉积牺牲树脂层（15）; 通过光刻产生在所述牺牲树脂层的表面中的多个孔; 通过电解在形成在牺牲树脂（15）中的阱内沉积旨在形成可变形膜（20）的至少一个金属区域，该金属区域在位于金属带（10,11）的部分之间延伸 在所述固定板（1）的每一侧上; 去除牺牲树脂层（15）。