公开(公告)号：KR20200125752A

公开(公告)日：2020-11-04

申请号：KR20207030577

申请日：2009-08-27

Applicant: NICHIA CORP

Inventor： ICHIKAWA HIROFUMI ,  HAYASHI MASAKI ,  SASAOKA SHIMPEI ,  MIKI TOMOHIDE

IPC: H01L33/48 ,  B29C45/00 ,  B29C45/14 ,  H01L23/00 ,  H01L33/00 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: 리드프레임과열경화성수지조성물과의밀착성이높고, 단시간에다수개의발광장치를제조하는간이하고또한염가의방법을제공하는것을목적으로한다. 열경화후의, 파장 350㎚∼800㎚에서의광 반사율이 70% 이상이고, 외측면(20b)에서수지부(25)와리드(22)가대략동일면에형성되어있는수지패키지(20)를갖는발광장치의제조방법으로서, 절결부(21a)를형성한리드프레임(21)을상부금형(61)과하부금형(62) 사이에끼워넣는공정과, 상부금형(61)과하부금형(62) 사이에끼워넣어진금형(60) 내에, 광반사성물질(26)이함유되는열경화성수지(23)를트랜스퍼몰드하여, 리드프레임(21)에수지성형체(24)를형성하는공정과, 절결부(21a)를따라서수지성형체(23)와리드프레임(21)을절단하는공정을갖는발광장치의제조방법에관한것이다.

公开(公告)号：EP2325901A4

公开(公告)日：2013-12-25

申请号：EP09811246

申请日：2009-08-27

Applicant: NICHIA CORP

Inventor： ICHIKAWA HIROFUMI ,  HAYASHI MASAKI ,  SASAOKA SHIMPEI ,  MIKI TOMOHIDE

IPC: H01L33/00 ,  B29C45/00 ,  B29C45/14 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/486 ,  B29C45/0055 ,  B29C45/14655 ,  B29C2793/009 ,  H01L24/97 ,  H01L33/504 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).

公开(公告)号：EP1939949A4

公开(公告)日：2013-08-21

申请号：EP06810833

申请日：2006-09-29

Applicant: NICHIA CORP

Inventor： KITANI MOTOHISA ,  ICHIKAWA HIROFUMI ,  TSUKIOKA TOMOYA ,  MIKI TOMOHIDE ,  KURAMOTO MASAFUMI

IPC: H01L33/00 ,  C08L77/00 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00