公开(公告)号：EP1587351A4

公开(公告)日：2009-04-01

申请号：EP04807052

申请日：2004-12-15

Applicant: PANASONIC CORP

Inventor： TAKENAKA TOSHIAKI ,  KONDOU TOSHIKAZU ,  HIRAISHI YUKIHIRO ,  KISHIMOTO KUNIO

IPC: B41F15/08 ,  B41F15/40 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2203/0191 ,  H05K2203/0228 ,  H05K2203/063 ,  H05K2203/1461

Abstract: A mask film (2a) wherein a squeegee cleaning portion (6) is formed in advance in a certain position and another mask film (2b) are respectively bonded to the opposed surfaces of a substrate material. Then a through hole (3) is formed by a laser, and the through hole (3) is filled with a conductive paste (4) by squeegeeing. Consequently, the paste is prevented from remaining on top of the through hole (3), so that there can be obtained a circuit board having excellent connection quality.

公开(公告)号：EP2571340A4

公开(公告)日：2014-01-08

申请号：EP12776691

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2571341A4

公开(公告)日：2013-12-11

申请号：EP12777429

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KONDOU TOSHIKAZU ,  KATSUMATA MASAAKI

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2590488A4

公开(公告)日：2013-10-23

申请号：EP12816628

申请日：2012-07-24

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K3/40 ,  B05C11/10 ,  H01B13/00 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/0094 ,  H01B1/20 ,  H01B1/22 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.