公开(公告)号：EP1631137A4

公开(公告)日：2009-05-27

申请号：EP05726702

申请日：2005-03-17

Applicant: PANASONIC CORP

Inventor： FUJIWARA JOJI ,  HIMORI TSUYOSHI ,  TSUNEOKA MICHIAKI

IPC: H05K9/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L23/29 ,  H01L23/552 ,  H01L2924/15159 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/09972 ,  H05K2201/10204

Abstract: On a board (11) of a module component, a mounting component (12) and a conductive divider (13) which divides a circuit block into at least two circuit blocks are mounted, a sealing body (14) for covering the circuit block is provided, and a conductive film (16) is provided on a surface of the sealing body (14). The module component is electrically shielded by every group of circuit blocks. The module component provides sufficient shielding effects without increasing the number of manufacturing processes, maintains bending strength and has a small warp.

公开(公告)号：EP2389052A4

公开(公告)日：2012-01-18

申请号：EP11728762

申请日：2011-02-22

Applicant: PANASONIC CORP ,  KYOTO ELEX CO LTD

Inventor： HIRAI SHOGO ,  ISHITOMI HIROYUKI ,  HIMORI TSUYOSHI ,  TOMEKAWA SATORU ,  NAKAYAMA YUTAKA

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2203/0425

公开(公告)号：EP2571340A4

公开(公告)日：2014-01-08

申请号：EP12776691

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2555602A4

公开(公告)日：2013-12-25

申请号：EP11854015

申请日：2011-12-09

Applicant: PANASONIC CORP

Inventor： HIGUCHI TAKAYUKI ,  HIRAI SHOGO ,  HIMORI TSUYOSHI ,  ISHITOMI HIROYUKI

IPC: H05K3/46 ,  H01L23/12 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/4069 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425 ,  H05K2203/043 ,  H01L2924/00

Abstract: Disclosed is a multilayer wiring board having via-hole conductors for connecting a first copper wiring and a second copper wiring, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region including a link of copper particles as a path for electrically connecting the first and second copper wirings; a second metal region mainly composed of at least one selected from tin, a tin-copper alloy, and a tin-copper intermetallic compound; and a third region mainly composed of bismuth. The copper particles forming the link are in plane-to-plane contact with one another. At least one of the first copper wiring and the second copper wiring is in plane-to-plane contact with the copper particles, and the portion where there is such a plane-to-plane contact is covered with at least a part of the second metal region.

公开(公告)号：EP2563103A4

公开(公告)日：2013-05-15

申请号：EP11856268

申请日：2011-12-19

Applicant: PANASONIC CORP ,  KYOTO ELEX CO LTD

Inventor： HIRAI SHOGO ,  HIMORI TSUYOSHI ,  ISHITOMI HIROYUKI ,  HIGUCHI TAKAYUKI ,  TOMEKAWA SATORU ,  NAKAYAMA YUTAKA

IPC: H05K1/11 ,  H01B5/00 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H05K1/09 ,  H05K1/095 ,  H05K3/10 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49155

公开(公告)号：EP2571341A4

公开(公告)日：2013-12-11

申请号：EP12777429

申请日：2012-04-19

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KONDOU TOSHIKAZU ,  KATSUMATA MASAAKI

IPC: H05K1/09 ,  B05C11/10 ,  H01B1/20 ,  H01B13/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H01B1/02 ,  H01B1/12 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

公开(公告)号：EP2590488A4

公开(公告)日：2013-10-23

申请号：EP12816628

申请日：2012-07-24

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  KATSUMATA MASAAKI ,  KONDOU TOSHIKAZU

IPC: H05K3/40 ,  B05C11/10 ,  H01B13/00 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/0094 ,  H01B1/20 ,  H01B1/22 ,  H05K1/092 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.

公开(公告)号：EP1581032A4

公开(公告)日：2009-10-21

申请号：EP04819794

申请日：2004-11-29

Applicant: PANASONIC CORP

Inventor： HIMORI TSUYOSHI ,  HIRAI SHOGO

IPC: H05K1/16 ,  H05K3/24 ,  H05K3/28

CPC classification number: H05K3/246 ,  H05K1/092 ,  H05K1/165 ,  H05K3/24 ,  H05K3/28 ,  H05K2201/0347 ,  H05K2203/0315 ,  Y10T428/24917 ,  Y10T428/24926