公开(公告)号：WO1995005938A1

公开(公告)日：1995-03-02

申请号：PCT/US1994009495

申请日：1994-08-23

Applicant: PARLEX CORPORATION

Inventor： PARLEX CORPORATION ,  MC KENNEY, Darryl, J. ,  CYR, Robert, D.

IPC: B32B03/00

CPC classification number: H05K3/4611 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T428/1438 ,  Y10T428/24917 ,  Y10T428/31515 ,  Y10T428/31522

Abstract: A printed circuit board (10) and method of manufacture thereof is disclosed. The printed circuit board (10) includes a first substrate provided from a conductive layer (12) having disposed on a first surface (12a) thereof a cured adhesive layer (14). A semi-cured adhesive layer (16) is then disposed over the cured adhesive layer (14) and a second substrate (18) is disposed against the semi-cured adhesive layer (16).

Abstract translation: 公开了一种印刷电路板（10）及其制造方法。 印刷电路板（10）包括由导电层（12）提供的第一基板，该第一基板在其第一表面（12a）上设置有固化的粘合剂层（14）。 然后将半固化粘合剂层（16）设置在固化的粘合剂层（14）上，并且第二基底（18）设置在半固化的粘合剂层（16）上。

公开(公告)号：WO1996005970A1

公开(公告)日：1996-02-29

申请号：PCT/US1994009721

申请日：1994-08-25

Applicant: PARLEX CORPORATION

Inventor： PARLEX CORPORATION ,  MC KENNEY, Darryl, J. ,  CYR, Robert, D.

IPC: B44C01/22

CPC classification number: H05K3/108 ,  H05K3/426 ,  H05K2201/0344

Abstract: A method of depositing a conductive material (20) on a surface of a printed circuit board (10) includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer (16) over the chemically treated surface (12), depositing a conductive layer (20) in the areas which are not covered by the resist (16), stripping the resist from the surface of the printed circuit board (10), and cleaning exposed chemically treated surfaces of the printed circuit board (10) to remove contaminants from the surface of the printed circuit board (10) which were introduced in the chemically treating step.

Abstract translation: 在印刷电路板（10）的表面上沉积导电材料（20）的方法包括以下步骤：化学处理印刷电路板的表面的至少一部分，将抗蚀剂层（16）设置在化学上 处理表面（12），在未被抗蚀剂（16）覆盖的区域中沉积导电层（20），从印刷电路板（10）的表面剥离抗蚀剂，以及清洁暴露的化学处理的表面 印刷电路板（10）以从化学处理步骤中引入的印刷电路板（10）的表面去除污染物。