Abstract:
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer , or by posts underlying depressions in the conductive movable layer. In certa in embodiments, portions of the rivet structures extend through the movable lay er and contact underlying layers. In other embodiments, the material used to fo rm the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
Abstract:
Higher capacitance density is achieved by increasing a surface area of a capacitor. A larger surface area may be obtained by forming isotropic ball shapes (a concave surface) in the trenches on the semiconductor die. The concave surfaces are fabricated by depositing bilayers of amorphous silicon and silicon oxide. Openings are patterned in the silicon oxide hard mask for trenches. The openings are transferred to the amorphous silicon layers through isotropic etching to form concave surfaces. Conducting insulating and conducting layers are deposited on the concave surfaces of the trenches by atomic layer deposition.
Abstract:
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.
Abstract:
Se describen metodos para escribir datos de pantalla a elementos de pantalla de MEMS que estan configurados para minimizar la acumulacion de carga y envejecimiento diferencial. De manera simultanea a la escritura de hileras de datos de imagen, se efectua una operacion de pre-escritura en una siguiente hilera. La operacion de pre-escritura escribe ya sea datos de imagen o el inverso de los datos de imagen a la siguiente hilera. En algunas modalidades, la seleccion entre la escritura de datos de imagen y escritura de datos de imagen inversos se efectua de manera aleatoria o pseudo-aleatoria.
Abstract:
Two-sided, back-to-back displays (100) are formed by sealing the backplates (130, 230) of two displays (110, 210) against one another. Mechanical parameters of the backplates (130, 230), e.g., stiffness and strength, do not meet the requirements for standalone one-sided displays which are otherwise similar to the two displays (110, 210). However, when sealed against one another, the backplates (130, 230) reinforce each other to meet or exceed the requirements for both one-sided and two-sided displays. The presence of backplates (130, 230) on each of the constituent one-sided displays (110, 210) allows one or both of those displays (110, 210) to be individually tested, thereby increasing the production yield of the back-to-back displays (100). The display elements (150) of the displays (110, 210) can comprise interferometric modulators.
Abstract:
A display array which can reduce the row connections between the display and the driver circuit and methods of manufacturing and operating the same are disclosed. In one embodiment, a display device comprises an array of MEMS display elements and a plurality of voltage dividers coupled to the array and configured to provide row output voltages to drive the array, wherein each row is connected to at least two inputs joined by a voltage divider.
Abstract:
The invention comprises systems and methods determining residual stress such as that found in interferometric modulators. In one example, a test unit can be configured to indicate residual stress in a film by interferometrically modulating light indicative of an average residual stress in two orthogonal directions of the substrate. The test unit can include a reflective membrane attached to the substrate where membrane is configured as a parallelogram with at least a portion of each side attached to the substrate, and an interferometric cavity formed between a portion of the membrane and a portion of the substrate, and where the membrane is configured to deform based on the residual stress of in the film and modulate light indicative of the amount of membrane deformation.