公开(公告)号：IN2599CHN2014A

公开(公告)日：2015-08-07

申请号：IN2599CHN2014

申请日：2014-04-04

Applicant: QUALCOMM INC

Inventor： HADJICHRISTOS ARISTOTELE ,  SAHOTA GURKANWAL SINGH ,  CICCARELLI STEVEN C ,  WILDING DAVID J ,  LANE RYAN D ,  HOLENSTEIN CHRISTIAN ,  SHAH MILIND P

IPC: H01L25/16 ,  H01L23/66

Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package (306). The first radio frequency package includes radio frequency components (310 312 314 316). The radio frequency package on package (PoP) circuit also includes a second radio frequency package (308). The second radio frequency package includes radio frequency components (322 324). The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.