公开(公告)号：BR112012022063A2

公开(公告)日：2016-08-30

申请号：BR112012022063

申请日：2011-02-28

Applicant: QUALCOMM INC

Inventor： GASTELUM DAMION B ,  SWEENEY FIFIN ,  VELEZ MARIO FRANCISCO ,  SHAH MILIND P

IPC: H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10

公开(公告)号：IN2599CHN2014A

公开(公告)日：2015-08-07

申请号：IN2599CHN2014

申请日：2014-04-04

Applicant: QUALCOMM INC

Inventor： HADJICHRISTOS ARISTOTELE ,  SAHOTA GURKANWAL SINGH ,  CICCARELLI STEVEN C ,  WILDING DAVID J ,  LANE RYAN D ,  HOLENSTEIN CHRISTIAN ,  SHAH MILIND P

IPC: H01L25/16 ,  H01L23/66

Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package (306). The first radio frequency package includes radio frequency components (310 312 314 316). The radio frequency package on package (PoP) circuit also includes a second radio frequency package (308). The second radio frequency package includes radio frequency components (322 324). The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.

公开(公告)号：WO2011109310A3

公开(公告)日：2011-10-27

申请号：PCT/US2011026539

申请日：2011-02-28

Applicant: QUALCOMM INC ,  SWEENEY FIFIN ,  SHAH MILIND P ,  VELEZ MARIO FRANCISCO ,  GASTELUM DAMION B

Inventor： SWEENEY FIFIN ,  SHAH MILIND P ,  VELEZ MARIO FRANCISCO ,  GASTELUM DAMION B

IPC: H01L23/498 ,  H01L23/367 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L23/3677 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/25 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/82001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.

Abstract translation: 在具有封装衬底和封装触点的多模块集成电路封装中，裸片被嵌入封装衬底中，其中热通孔将嵌入裸片上的热点耦合到一些封装触点。

公开(公告)号：WO2011094594A3

公开(公告)日：2011-12-08

申请号：PCT/US2011022999

申请日：2011-01-28

Applicant: QUALCOMM INC ,  SHAH MILIND P ,  VELEZ MARIO FRANCISCO ,  SWEENEY FIFIN

Inventor： SHAH MILIND P ,  VELEZ MARIO FRANCISCO ,  SWEENEY FIFIN

IPC: B81C1/00

CPC classification number: B81C1/0023 ,  B81B2207/012 ,  B81B2207/098 ,  B81C2203/035 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An integrated circuit package includes a microelectromechanical systems (MEMS) device embedded in a packaging substrate. The MEMS device is located on a die embedded in the packaging substrate and covered by a hermetic seal. Low-stress material in the packaging substrate surrounds the MEMS device. Additionally, interconnects may be used as standoffs to reduce stress on the MEMS device. The MEMS device is embedded a distance into the packaging substrate leaving for example, 30-80 microns, between the hermetic seal of the MEMS device and the support surface of the packaging substrate. Embedding the MEMS device results in lower stress on the MEMS device.

Abstract translation: 集成电路封装包括嵌入在封装衬底中的微机电系统（MEMS）器件。 MEMS器件位于封装在封装衬底中的模具上并被气密密封覆盖。 封装基板中的低应力材料围绕着MEMS器件。 此外，互连可以用作支架以减小MEMS器件上的应力。 MEMS器件在MEMS器件的气密密封和封装衬底的支撑表面之间在距离包装衬底一段距离（例如30-80微米）内被嵌入。 嵌入MEMS器件导致MEMS器件的较低应力。