公开(公告)号：EP4046189A2

公开(公告)日：2022-08-24

申请号：EP20808226.3

申请日：2020-10-16

Applicant: Qualcomm Incorporated

Inventor： SUN, Yangyang ,  HOLMES, John ,  ZHANG, Xuefeng ,  HE, Dongming

IPC: H01L23/485 ,  H01L21/60 ,  G06T7/00

公开(公告)号：WO2021162816A1

公开(公告)日：2021-08-19

申请号：PCT/US2021/013176

申请日：2021-01-13

Applicant: QUALCOMM INCORPORATED

Inventor： RAE, David Fraser ,  HOLMES, John ,  HSU, Marcus ,  KANG, Kuiwon ,  SODHI, Avantika

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433

Abstract: A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.

公开(公告)号：WO2021076872A2

公开(公告)日：2021-04-22

申请号：PCT/US2020/055953

申请日：2020-10-16

Applicant: QUALCOMM INCORPORATED

Inventor： SUN, Yangyang ,  HOLMES, John ,  ZHANG, Xuefeng ,  HE, Dongming

IPC: H01L23/485 ,  H01L21/60 ,  G06T7/00 ,  G06T7/0006 ,  H01L2224/037 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16112 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2924/15747

Abstract: Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.

公开(公告)号：EP4104211A1

公开(公告)日：2022-12-21

申请号：EP21704348.8

申请日：2021-01-13

Applicant: QUALCOMM INCORPORATED

Inventor： RAE, David Fraser ,  HOLMES, John ,  HSU, Marcus ,  KANG, Kuiwon ,  SODHI, Avantika

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433