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公开(公告)号：WO2019108360A1
公开(公告)日：2019-06-06
申请号：PCT/US2018/059726
申请日：2018-11-08
Applicant: QUALCOMM INCORPORATED
Inventor： KIDWELL JR., Donald William , SHENOY, Ravindra Vaman , LEWIS, Alan , FERGUSON, Christopher Feuling
IPC: H01L49/02 , H01L23/522 , H01L23/64 , H01F17/00 , H01F41/04
Abstract: Some aspects pertain to an inductor apparatus that includes a first metal layer including a plurality of first interconnects, a second metal including a plurality of second interconnects, a first dielectric layer between the first metal layer and the second metal layer, and an inductor. The inductor includes a plurality of vias, where the plurality of vias are configured to couple the plurality of first interconnects to the plurality of second interconnects. The inductor includes a plurality of inductor loops formed by the plurality of vias, the plurality of first interconnects and the plurality of second interconnects. The inductor further includes a first magnetic layer and a second magnetic layer, located between the first interconnects and the second interconnects; and a third magnetic layer and an optional fourth magnetic layer outside of the plurality of inductor loops.
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2.发明申请
公开(公告)号：WO2015175123A1
公开(公告)日：2015-11-19
申请号：PCT/US2015/025522
申请日：2015-04-13
Applicant: QUALCOMM INCORPORATED
Inventor： LAI, Kwan-yu , SHENOY, Ravindra Vaman , KIM, Jitae , LASITER, Jon Bradley , KIDWELL JR., Donald William , GOUSEV, Evgeni Petrovich
CPC classification number: H04B10/50 , G01J1/0407 , G02B6/00 , G02B6/4212 , G02B6/428 , G02B6/43 , H03F3/08 , H04B10/501
Abstract: An apparatus includes a substrate (402) and a waveguide (410) coupled to a surface of the substrate. The surface of the substrate forms a cladding layer of the waveguide. The apparatus includes a photodetector (PD) optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal. The assembly is positioned on a PCB (604) and electrically connected thereto.
Abstract translation: 一种设备包括耦合到衬底表面的衬底（402）和波导（410）。 衬底的表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器（PD）。 光电检测器被配置为响应于从波导的核心接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。 组件定位在PCB（604）上并与其电连接。
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Patent Agency Ranking
公开(公告)号：WO2021257186A1
公开(公告)日：2021-12-23
申请号：PCT/US2021/029231
申请日：2021-04-26
Applicant: QUALCOMM INCORPORATED
Inventor： SIVALINGAM, Ravishankar , KIDWELL JR., Donald William , GRUHLKE, Russell , PARK, Edwin Chongwoo , ALAM, Khurshid Syed
IPC: G06T7/73 , G06F3/012 , G06F3/0346 , G06T2207/10048 , G06T2207/20084 , G06T2207/30204 , G06T2207/30244 , H04N5/247
Abstract: Systems, methods, and non-transitory media are provided for low-power visual tracking systems. An example method can include receiving one or more images captured by each image sensor system from a set of image sensor systems on a first device, the one or more images capturing a set of patterns on a second device, wherein the first device has lower power requirements than the second device, the set of patterns having a predetermined configuration on the second device; determining, from the one or more images captured by each image sensor system, a set of pixels corresponding to the set of patterns on the second device; determining, based on the set of pixels corresponding to the set of patterns, a location and relative pose in space of each pattern; and determining, based on the location and relative pose of each pattern, a pose of the first device relative to the second device.
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公开(公告)号：WO2019040270A1
公开(公告)日：2019-02-28
申请号：PCT/US2018/045401
申请日：2018-08-06
Applicant: QUALCOMM INCORPORATED
Inventor： LASITER, Jon Bradley , SHENOY, Ravindra Vaman , KIDWELL JR., Donald William , TASSOUDJI, Mohammad Ali , VELEZ, Mario Francisco
Abstract: An package and related methods are disclosed. The package may include an antenna, an insert made of low-loss material, and a mold, wherein the mold directly contacts and surrounds at least a portion of the insert, wherein the antenna is formed of conductive material disposed at least in part on a surface of the insert.
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公开(公告)号：EP3718153A1
公开(公告)日：2020-10-07
申请号：EP18811684.2
申请日：2018-11-08
Applicant: Qualcomm Incorporated
Inventor： KIDWELL JR., Donald William , SHENOY, Ravindra Vaman , LEWIS, Alan , FERGUSON, Christopher Feuling
IPC: H01L49/02 , H01L23/522 , H01L23/64 , H01F17/00 , H01F41/04
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公开(公告)号：EP3423199A1
公开(公告)日：2019-01-09
申请号：EP17702748.9
申请日：2017-01-23
Applicant: Qualcomm Incorporated
Inventor： KIDWELL JR., Donald William , SHENOY, Ravindra , LASITER, Jon
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7.发明公开ELECTRO-OPTICAL TRANSCEIVER DEVICE TO ENABLE CHIP-TO-CHIP INTERCONNECTION 审中-公开ELEKTROOPTISCHER SENDER-EMPFÄNGERFÜRCHIP-ZU-CHIP-VERBINDUNG
公开(公告)号：EP3143445A1
公开(公告)日：2017-03-22
申请号：EP15718337.7
申请日：2015-04-13
Applicant: Qualcomm Incorporated
Inventor： LAI, Kwan-yu , SHENOY, Ravindra Vaman , KIM, Jitae , LASITER, Jon Bradley , KIDWELL JR., Donald William , GOUSEV, Evgeni Petrovich
CPC classification number: H04B10/50 , G01J1/0407 , G02B6/00 , G02B6/4212 , G02B6/428 , G02B6/43 , H03F3/08 , H04B10/501
Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.
Abstract translation: 一种装置包括衬底和耦合到衬底表面的波导。 表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器。 光电检测器被配置为响应于从波导的芯接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。
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