公开(公告)号：WO2016089539A1

公开(公告)日：2016-06-09

申请号：PCT/US2015/059198

申请日：2015-11-05

Applicant: QUALCOMM INCORPORATED

Inventor： ERTURK, Mete ,  SHENOY, Ravindra Vaman ,  LAI, Kwan-yu ,  KIM, Jitae ,  KIDWELL, JR., Donald William ,  LASITER, Jon Bradley ,  DOYLE, James Thomas ,  BCHIR, Omar James

IPC: H01F17/00 ,  H01F41/04 ,  H01L23/00 ,  H05K1/16

CPC classification number: H01F27/2804 ,  H01F1/14708 ,  H01F5/00 ,  H01F17/0033 ,  H01F27/24 ,  H01F41/02 ,  H01F41/046 ,  H01F41/14 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/111 ,  H05K1/165 ,  H05K1/182 ,  H05K2201/10166 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

Abstract translation: 电感器可以包括第一基板，磁片和导体。 第一衬底可以形成在第二衬底内。 磁片可以连接到第一衬底的第一侧。 导体可以形成在第二基板内，第二基板上，或两者上。 导体可以具有输入和输出。 导体可以被配置为围绕第一基板而不与第一基板接触，而不与磁片接触。

公开(公告)号：WO2015120375A1

公开(公告)日：2015-08-13

申请号：PCT/US2015/014995

申请日：2015-02-09

Applicant: QUALCOMM INCORPORATED

Inventor： YUN, Changhan Hobie ,  KIM, Daeik Daniel ,  ZUO, Chengjie ,  KIM, Jonghae ,  VELEZ, Mario Francisco ,  KIDWELL, JR., Donald William ,  LASITER, Jon Bradley ,  LAI, Kwan-Yu ,  KIM, Jitae ,  SHENOY, Ravindra Vaman

IPC: H01L49/02 ,  H01G4/33 ,  H01G4/012 ,  H01L21/48 ,  H01L27/12

CPC classification number: H01L28/90 ,  H01G4/012 ,  H01G4/33 ,  H01L21/28282 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5223 ,  H01L27/0805 ,  H01L27/12 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are space-efficient capacitors that have a higher quality factor than conventional designs and improve coupling of electrical energy from a through-glass via (TGV) to a dielectric. For example, provided is a TGV having a non-rectangular cross-section, where one end of the TGV is coupled to a first metal plate. A dielectric material is formed on the first metal plate. A second metal plate is formed on the dielectric material in a manner that overlaps at least a portion of the first metal plate to form at least one overlapped region of the dielectric material. At least a part of the perimeter of the overlapped region is non-planar. The overlapped region can be formed in a shape of a closed ring, in a plurality of portions of a ring shape, in substantially a quarter of a ring shape, and/or in substantially a half of a ring shape.

Abstract translation: 提供的空间效率电容器具有比传统设计更高的品质因数，并且改善了从直通玻璃通孔（TGV）到电介质的电能的耦合。 例如，提供了具有非矩形横截面的TGV，其中TGV的一端耦合到第一金属板。 在第一金属板上形成电介质材料。 第二金属板以与第一金属板的至少一部分重叠以形成电介质材料的至少一个重叠区域的方式形成在电介质材料上。 重叠区域的周边的至少一部分是非平面的。 重叠区域可以形成为环形的多个部分中的大致四分之一环形的闭环形状和/或大致一半的环形形状。

公开(公告)号：WO2015175123A1

公开(公告)日：2015-11-19

申请号：PCT/US2015/025522

申请日：2015-04-13

Applicant: QUALCOMM INCORPORATED

Inventor： LAI, Kwan-yu ,  SHENOY, Ravindra Vaman ,  KIM, Jitae ,  LASITER, Jon Bradley ,  KIDWELL JR., Donald William ,  GOUSEV, Evgeni Petrovich

IPC: G02B6/42 ,  G02B6/00

CPC classification number: H04B10/50 ,  G01J1/0407 ,  G02B6/00 ,  G02B6/4212 ,  G02B6/428 ,  G02B6/43 ,  H03F3/08 ,  H04B10/501

Abstract: An apparatus includes a substrate (402) and a waveguide (410) coupled to a surface of the substrate. The surface of the substrate forms a cladding layer of the waveguide. The apparatus includes a photodetector (PD) optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal. The assembly is positioned on a PCB (604) and electrically connected thereto.

Abstract translation: 一种设备包括耦合到衬底表面的衬底（402）和波导（410）。 衬底的表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器（PD）。 光电检测器被配置为响应于从波导的核心接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。 组件定位在PCB（604）上并与其电连接。

公开(公告)号：EP3143445A1

公开(公告)日：2017-03-22

申请号：EP15718337.7

申请日：2015-04-13

Applicant: Qualcomm Incorporated

Inventor： LAI, Kwan-yu ,  SHENOY, Ravindra Vaman ,  KIM, Jitae ,  LASITER, Jon Bradley ,  KIDWELL JR., Donald William ,  GOUSEV, Evgeni Petrovich

IPC: G02B6/42 ,  G02B6/00

CPC classification number: H04B10/50 ,  G01J1/0407 ,  G02B6/00 ,  G02B6/4212 ,  G02B6/428 ,  G02B6/43 ,  H03F3/08 ,  H04B10/501

Abstract: An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal.

Abstract translation: 一种装置包括衬底和耦合到衬底表面的波导。 表面形成波导的包覆层。 该装置包括光耦合到波导的端部的光电检测器。 光电检测器被配置为响应于从波导的芯接收光信号而输出电信号。 该装置还包括耦合到基板的放大器装置。 放大器装置电耦合到光电检测器以放大电信号以产生放大的电信号。