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1.发明申请METHOD TO OPTIMIZE AND REDUCE INTEGRATED CIRCUIT, PACKAGE DESIGN, AND VERIFICATION CYCLE TIME 审中-公开优化和减少集成电路，封装设计和验证周期时间的方法
公开(公告)号：WO2012040450A2
公开(公告)日：2012-03-29
申请号：PCT/US2011/052744
申请日：2011-09-22
Applicant: QUALCOMM Incorporated , LANE, Ryan D. , ZANG, Ruey Kae
Inventor： LANE, Ryan D. , ZANG, Ruey Kae
IPC: G06F17/50
CPC classification number: G06F17/5068 , G06F2217/40 , H01L2224/16227 , H01L2924/15311 , H01L2924/1532
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公开(公告)号：WO2013074846A1
公开(公告)日：2013-05-23
申请号：PCT/US2012/065363
申请日：2012-11-15
Applicant: QUALCOMM INCORPORATED
Inventor： HADJICHRISTOS, Aristotele , SAHOTA, Gurkanwal Singh , CICCARELLI, Steven C. , WILDING, David J. , LANE, Ryan D. , HOLENSTEIN, Christian , SHAH, Milind P.
CPC classification number: H05K3/368 , H01L23/66 , H01L25/16 , H01L2224/16225 , H01L2924/1461 , H01L2924/15311 , H01L2924/15321 , H04B1/40 , H05K13/0465 , Y10T29/49126 , Y10T29/5317 , H01L2924/00
Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package (306). The first radio frequency package includes radio frequency components (310, 312, 314, 316). The radio frequency package on package (PoP) circuit also includes a second radio frequency package (308). The second radio frequency package includes radio frequency components (322, 324). The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.
Abstract translation: 描述了封装（PoP）电路上的射频封装。 封装（PoP）电路上的射频封装包括第一射频封装（306）。 第一射频包包括射频分量（310,312,314,316）。 封装（PoP）电路上的射频封装还包括第二射频封装（308）。 第二射频包包括射频分量（322,324）。 第一射频包和第二射频包处于垂直配置。 第一个射频封装上的射频分量被设计为减少接地电感的影响。
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3.发明公开METHOD TO OPTIMIZE AND REDUCE INTEGRATED CIRCUIT, PACKAGE DESIGN, AND VERIFICATION CYCLE TIME 审中-公开方法优化和还原的集成电路的VERKAPSELUNGSENTWURFS和测试周期的
公开(公告)号：EP2619698A1
公开(公告)日：2013-07-31
申请号：EP11770933.7
申请日：2011-09-22
Applicant: Qualcomm Incorporated
Inventor： LANE, Ryan D. , ZANG, Ruey Kae
IPC: G06F17/50
CPC classification number: G06F17/5068 , G06F2217/40 , H01L2224/16227 , H01L2924/15311 , H01L2924/1532
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公开(公告)号：EP2780941A1
公开(公告)日：2014-09-24
申请号：EP12805818.7
申请日：2012-11-15
Applicant: Qualcomm Incorporated
Inventor： HADJICHRISTOS, Aristotele , SAHOTA, Gurkanwal Singh , CICCARELLI, Steven C. , WILDING, David J. , LANE, Ryan D. , HOLENSTEIN, Christian , SHAH, Milind P.
CPC classification number: H05K3/368 , H01L23/66 , H01L25/16 , H01L2224/16225 , H01L2924/1461 , H01L2924/15311 , H01L2924/15321 , H04B1/40 , H05K13/0465 , Y10T29/49126 , Y10T29/5317 , H01L2924/00
Abstract: A radio frequency package on package (PoP) circuit is described. The radio frequency package on package (PoP) circuit includes a first radio frequency package (306). The first radio frequency package includes radio frequency components (310, 312, 314, 316). The radio frequency package on package (PoP) circuit also includes a second radio frequency package (308). The second radio frequency package includes radio frequency components (322, 324). The first radio frequency package and the second radio frequency package are in a vertical configuration. The radio frequency components on the first radio frequency package are designed to reduce the effects of ground inductance.
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