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    CONNECTING DEVICE
    1.
    发明专利
    CONNECTING DEVICE 未知

    公开(公告)号：GB2112222B

    公开(公告)日：1986-04-23

    申请号：GB8234720

    申请日：1982-12-06

    Applicant: RAYCHEM CORP

    Inventor： CHERIAN GABE

    IPC: H01R13/03 ,  B23P11/02 ,  H01R4/01 ,  H01R4/00

    Abstract: A connecting device comprises a body of shape memory metal 10 capable of reversing between a martensitic and an ausenitic state, the body comprising at least two arms 14,16 cantilevered to form a support means 18 which joins the arms. The arms 14,16 are deformable with low force when the body is in its martensitic state and the arms revert towards their undeformed state when the body is in its austenitic state.Preferably the arms 14,16 are deformable away from each other and converge to grip a substrate when the body is in its austenitic state.

    HEAT RECOVERABLE CONNECTING DEVICE AND MANUFACTURING METHOD
    2.
    发明专利
    HEAT RECOVERABLE CONNECTING DEVICE AND MANUFACTURING METHOD 未知

    公开(公告)号：CA1199088A

    公开(公告)日：1986-01-07

    申请号：CA417094

    申请日：1982-12-06

    Applicant: RAYCHEM CORP

    Inventor： CHERIAN GABE

    IPC: H01R13/03 ,  B23P11/02 ,  H01R4/01 ,  H01R4/10 ,  H01R43/04

    Abstract: A connecting device comprises a body of shape memory metal capable of reversing between a martensitic and an ausenitic state, the body comprising at least two arms 14,16 cantilevered to form a support means 18 which joins the arms. The arms 14,16 are deformable with low force when the body is in its martensitic state and the arms assert a high engaging force when the body is in its austenitic state. Preferably the arms 14,16 are deformable away from each other and converge to grip a substrate when the body is in its austenitic state.

    CONNECTING DEVICE
    3.
    发明专利
    CONNECTING DEVICE 未知

    公开(公告)号：GB2112222A

    公开(公告)日：1983-07-13

    申请号：GB8234720

    申请日：1982-12-06

    Applicant: RAYCHEM CORP

    Inventor： CHERIAN GABE

    IPC: H01R13/03 ,  B23P11/02 ,  H01R4/01 ,  H01R4/00

    Abstract: A connecting device comprises a body of shape memory metal 10 capable of reversing between a martensitic and an ausenitic state, the body comprising at least two arms 14,16 cantilevered to form a support means 18 which joins the arms. The arms 14,16 are deformable with low force when the body is in its martensitic state and the arms revert towards their undeformed state when the body is in its austenitic state.Preferably the arms 14,16 are deformable away from each other and converge to grip a substrate when the body is in its austenitic state.

    SOLDER COMPOSITION
    4.
    发明专利
    SOLDER COMPOSITION 未知

    公开(公告)号：CA1271397A

    公开(公告)日：1990-07-10

    申请号：CA481365

    申请日：1985-05-13

    Applicant: RAYCHEM CORP

    Inventor： CHERIAN GABE

    IPC: B23K35/02 ,  B23K35/22 ,  H05K3/34 ,  B23K35/24 ,  H05K13/04

    Abstract: SOLDER COMPOSITION A solder composition is used to form interconnects between electrical components, such as chip carriers and circuit boards, wherein the solder composition comprises solder paste and disposed in the solder paste a filler which may be particles or filaments which are solid at a temperature at which the solder is molten and are present in an amount and are of sufficient size and density to substantially maintain the solder in a preformed shape when the solder is molten. This filled solder paste can be screen printed on such components and can be layered to form an interconnect with increased height to better withstand thermal expansion stresses.

    CHIP MOUNTING DEVICE AND CHIP CARRIER MOUNTING DEVICE
    9.
    发明专利
    CHIP MOUNTING DEVICE AND CHIP CARRIER MOUNTING DEVICE 未知

    公开(公告)号：CA1226679A1

    公开(公告)日：1987-09-08

    申请号：CA457810

    申请日：1984-06-29

    Applicant: RAYCHEM CORP

    Inventor： ALLEN LESLIE J ,  CHERIAN GABE ,  DIAZ STEPHEN H

    IPC: B23K3/06 ,  B23K35/02 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K13/04

    Abstract: A chip carrier mounting device includes a retaining member having a redefined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

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