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公开(公告)号:WO9932865A3
公开(公告)日:1999-11-04
申请号:PCT/US9827388
申请日:1998-12-22
Applicant: ROSEMOUNT AEROSPACE INC , BANG CHRISTOPHER , NAGY MICHAEL L , YANG XIAOFENG , JUST MARCUS S
Inventor: BANG CHRISTOPHER , NAGY MICHAEL L , YANG XIAOFENG , JUST MARCUS S
CPC classification number: G01L19/143 , G01L19/0038 , G01L19/0645
Abstract: A media compatible package (100) for a pressure sensing device is made from a non-corrosive, highly chemical resistant material. The package includes a base (105) which holds a printed circuit board (115) having a pressure sensor (18) mounted thereon. A sealing member (45) is placed on the circuit board encircling the pressure sensor and a diaphragm (30) is disposed on the sealing member. A fluid port (130) is attached to the base and compressingly engages the diaphragm creating a sealed chamber around the pressure sensor. The sealed chamber is filled with a pressure transmissive fluid (21) such as oil through a fill hole (140) provided in the printed circuit board. This configuration allows the sensor package to be easily assembled with ordinary components and provides a design where all exposed surfaces of the package can be made from a highly non-corrosive material.
Abstract translation: 用于压力感测装置的介质兼容包(100)由非腐蚀性,高耐化学性的材料制成。 该包装件包括一个保持印刷电路板(115)的基座(105),该印刷电路板具有安装在其上的压力传感器(18)。 密封构件(45)被放置在环绕压力传感器的电路板上,并且隔膜(30)设置在密封构件上。 流体端口(130)附接到基座并且压缩地接合隔膜,从而产生围绕压力传感器的密封室。 该密封室通过设置在印刷电路板中的填充孔(140)填充有诸如油的压力传递流体(21)。 该配置允许传感器封装件容易地与普通部件组装,并且提供了一种设计,其中封装的所有暴露表面可以由高度非腐蚀性的材料制成。
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公开(公告)号:AU3585200A
公开(公告)日:2000-08-18
申请号:AU3585200
申请日:2000-01-28
Applicant: ROSEMOUNT AEROSPACE INC
Inventor: BANG CHRISTOPHER A , JUST MARCUS S , YANG XIAOFENG , NAGY MICHAEL L
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公开(公告)号:CA2315642A1
公开(公告)日:1999-07-01
申请号:CA2315642
申请日:1998-12-22
Applicant: ROSEMOUNT AEROSPACE INC
Inventor: BANG CHRISTOPHER , NAGY MICHAEL L , YANG XIAOFENG , JUST MARCUS S
Abstract: A media compatible package (100) for a pressure sensing device is made from a non-corrosive, highly chemical resistant material. The package includes a base (105) which holds a printed circuit board (115) having a pressure sensor (18) mounted thereon. A sealing member (45) is placed on the circuit board encircling the pressure sensor and a diaphragm (30) is disposed on the sealing member. A fluid port (130) is attached to the base and compressingly engages the diaphragm creating a sealed chamber around the pressure sensor. The sealed chamber is filled with a pressure transmissive fluid (21) such as oil through a fill hole (140) provided in the printed circuit board. This configuration allows the sensor package to be easily assembled with ordinary components and provides a design where all exposed surfaces of the package can be made from a highly non-corrosive material.
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