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    THREE AXIS ACCELEROMETER
    1.
    发明申请
    THREE AXIS ACCELEROMETER 审中-公开
    三轴加速度计

    公开(公告)号：WO0175455A2

    公开(公告)日：2001-10-11

    申请号：PCT/US0110681

    申请日：2001-04-03

    Applicant: ROSEMOUNT AEROSPACE INC ,  YANG XIAOFENG

    Inventor： YANG XIAOFENG

    IPC: G01P15/08 ,  G01P15/125 ,  G01P15/18 ,  H01L29/84 ,  G01P

    CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0842

    Abstract: A method for forming an accelerometer including the steps of providing a wafer of doped silicon, growing an oxide layer on the wafer, and forming an aperture in the oxide layer. The method further includes the steps of forming a layer of polysilicon on the wafer such that a portion of the polysilicon passes through the aperture and contacts the wafer, and etching the layer of polysilicon to form a beam and a capacitor plate. The wafer is then etched to form a response mass and a support, at least part of the response mass being located below the capacitor plate. Finally, the oxide layer is etched to separate the response mass from the support and from the capacitor plate, the response mass being coupled to the beam by polysilicon received through the aperture.

    Abstract translation: 一种用于形成加速度计的方法，包括以下步骤：提供掺杂硅晶片，在晶片上生长氧化物层，并在氧化物层中形成孔。 该方法还包括以下步骤：在晶片上形成多晶硅层，使得多晶硅的一部分穿过孔并接触晶片，并蚀刻多晶硅层以形成光束和电容器板。 然后对晶片进行蚀刻以形成响应质量块和支撑体，响应块的至少一部分位于电容器板下方。 最后，蚀刻氧化物层以将响应质量与载体和电容器板分离，响应质量通过孔接收的多晶硅耦合到光束。

    MEDIA COMPATIBLE PACKAGES FOR PRESSURE SENSING DEVICES
    2.
    发明申请
    MEDIA COMPATIBLE PACKAGES FOR PRESSURE SENSING DEVICES 审中-公开
    媒体兼容压力传感装置的包装

    公开(公告)号：WO9932865A3

    公开(公告)日：1999-11-04

    申请号：PCT/US9827388

    申请日：1998-12-22

    Applicant: ROSEMOUNT AEROSPACE INC ,  BANG CHRISTOPHER ,  NAGY MICHAEL L ,  YANG XIAOFENG ,  JUST MARCUS S

    Inventor： BANG CHRISTOPHER ,  NAGY MICHAEL L ,  YANG XIAOFENG ,  JUST MARCUS S

    IPC: G01L9/04 ,  G01L9/00 ,  G01L19/06 ,  G01L13/02 ,  G01L19/14

    CPC classification number: G01L19/143 ,  G01L19/0038 ,  G01L19/0645

    Abstract: A media compatible package (100) for a pressure sensing device is made from a non-corrosive, highly chemical resistant material. The package includes a base (105) which holds a printed circuit board (115) having a pressure sensor (18) mounted thereon. A sealing member (45) is placed on the circuit board encircling the pressure sensor and a diaphragm (30) is disposed on the sealing member. A fluid port (130) is attached to the base and compressingly engages the diaphragm creating a sealed chamber around the pressure sensor. The sealed chamber is filled with a pressure transmissive fluid (21) such as oil through a fill hole (140) provided in the printed circuit board. This configuration allows the sensor package to be easily assembled with ordinary components and provides a design where all exposed surfaces of the package can be made from a highly non-corrosive material.

    Abstract translation: 用于压力感测装置的介质兼容包（100）由非腐蚀性，高耐化学性的材料制成。 该包装件包括一个保持印刷电路板（115）的基座（105），该印刷电路板具有安装在其上的压力传感器（18）。 密封构件（45）被放置在环绕压力传感器的电路板上，并且隔膜（30）设置在密封构件上。 流体端口（130）附接到基座并且压缩地接合隔膜，从而产生围绕压力传感器的密封室。 该密封室通过设置在印刷电路板中的填充孔（140）填充有诸如油的压力传递流体（21）。 该配置允许传感器封装件容易地与普通部件组装，并且提供了一种设计，其中封装的所有暴露表面可以由高度非腐蚀性的材料制成。

    MEDIA COMPATIBLE PACKAGES FOR PRESSURE SENSING DEVICES
    5.
    发明专利
    MEDIA COMPATIBLE PACKAGES FOR PRESSURE SENSING DEVICES 未知

    公开(公告)号：CA2315642A1

    公开(公告)日：1999-07-01

    申请号：CA2315642

    申请日：1998-12-22

    Applicant: ROSEMOUNT AEROSPACE INC

    Inventor： BANG CHRISTOPHER ,  NAGY MICHAEL L ,  YANG XIAOFENG ,  JUST MARCUS S

    IPC: G01L9/04 ,  G01L9/00 ,  G01L19/06 ,  G01L13/02 ,  G01L19/14

    Abstract: A media compatible package (100) for a pressure sensing device is made from a non-corrosive, highly chemical resistant material. The package includes a base (105) which holds a printed circuit board (115) having a pressure sensor (18) mounted thereon. A sealing member (45) is placed on the circuit board encircling the pressure sensor and a diaphragm (30) is disposed on the sealing member. A fluid port (130) is attached to the base and compressingly engages the diaphragm creating a sealed chamber around the pressure sensor. The sealed chamber is filled with a pressure transmissive fluid (21) such as oil through a fill hole (140) provided in the printed circuit board. This configuration allows the sensor package to be easily assembled with ordinary components and provides a design where all exposed surfaces of the package can be made from a highly non-corrosive material.

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