Abstract:
PROBLEM TO BE SOLVED: To provide a larger high quality substrate.SOLUTION: A sapphire substrate comprises a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having an nTTV of about 0.037 μm/cmor less, where the nTTV is total thickness variation normalized for the surface area of the generally planar surface, the substrate having a diameter of about 9.0 cm or greater.
Abstract translation:要解决的问题:提供更大的高品质基板。 解决方案:蓝宝石衬底包括具有选自由a面,r面,m面和c面取向组成的组的结晶取向的大致平坦的表面,并且具有约0.037μm/ cm 2 SP>或更小,其中nTTV是对于大致平坦的表面的表面积归一化的总厚度变化,基底具有约9.0cm或更大的直径。 版权所有(C)2013,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a sapphire substrate that has a larger size than that of a conventional substrate and is of high quality.SOLUTION: The sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface, the substrate having a diameter not less than about 9.0 cm.
Abstract translation:要解决的问题:提供具有比常规基板大的尺寸的蓝宝石基板,并且具有高质量。 解决方案:蓝宝石衬底包括大致平坦的表面,其具有选自由a面,r面,m面和c面取向组成的组的结晶取向,并且具有不大于约的nTTV 0.037μm/ cm 2,其中nTTV是对于大致平坦的表面的表面积进行标准化的总厚度变化,基底的直径不小于约9.0cm。 版权所有(C)2013,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an ESD (electrostatic discharge) dissipative ceramic used for prevention of an ESD phenomenon and protection of a microelectronic device. SOLUTION: The ESD dissipative ceramic is a dense ceramic having ESD dissipative characteristics, tunable volume and surface resistivity in a semi-insulative range (10 3 to 10 11 Ωcm), substantially pore free, high flexible strength, and light colors. Because of desired ESD dissipation characteristics, structural reliability, high visual recognition, and low wear and particulate contamination, the ceramic is suitably used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, and containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an electrostatic discharge (ESD) dissipative ceramic. SOLUTION: The invention relates to a dense ceramic having ESD dissipative characteristics, tunable volume and surface resistivity in a semi-insulative range (10 3 to 10 11 Ωcm), substantially pore free, high flexible strength, light colors, for desired ESD dissipation characteristics, structural reliability, high visual recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for realigning a crystal orientation of a single crystal body such as a sapphire in the production of a single crystal for a semiconductor of a nitride material of group III and V elements, especially GaN.SOLUTION: A method for altering a crystal orientation of a single crystal body includes a step of analyzing the crystal orientation of a single crystal body and a step of calculating an angle of orientation difference between a selected crystal orientation of the single crystal body and a projection of crystal orientation along a first main outer surface of the single crystal body. The method further includes a step of removing a material from at least a part of the first main outer surface to alter the angle of orientation difference.
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic member for an ESD protection provided with a sufficient hardness, rigidity, wear resistance, abrasion resistance, and further provided with a suitable thermal conductivity and thermal expansion property. SOLUTION: In the ceramic member for the ESD protection containing a sintering composition formed from a base material and a resistivity regulator, the base material contains a primary component and a secondary component, and the primary component contains Al 2 O 3 and the secondary component contains a tetragonal ZrO 2 . COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
An article-is provided that includes a substrate and a corrosion-resistant coating provided on the substrate. The substrate generally consists essentially of alumina, and the corrosion-resistant coating is provided so as to directed contact the substrate without the provision of intervening layers between the substrate and the corrosion-resistant coatin, such as reaction products provided by high-temperature treatment processes. The corrosion-resistant coating generally consists essentially of a rare earth oxide, and has an adhesion strength not less than about 15 MPa. According to particular embodiments, the article is a ceramic component utilized and implemented in a semiconductor processing apparatus for processing semiconductor wafers.
Abstract:
An electrostatic chuck includes an insulating layer, a conductive layer overlying the insulating layer, a dielectric layer overlying the conductive layer, the dielectric layer having pores forming interconnected porosity, and a cured polymer infiltrant residing in the pores of the dielectric layer.
Abstract:
A susceptor for holding a single crystal wafer for LED production is provided which includes a susceptor body having a recess for receiving a single crystal wafer, wherein the recess has a surface having a surface roughness (R max 191) of not greater than about 10 microns. The susceptor body also includes silicon impregnated silicon carbide and a nitride layer overlying the susceptor body.
Abstract translation:提供了用于保持用于LED生产的单晶晶片的感受体,其包括具有用于接收单晶晶片的凹部的基座主体,其中所述凹部具有表面粗糙度(R max max)191的表面, 不大于约10微米。 基座体还包括硅浸渍的碳化硅和覆盖基座主体的氮化物层。
Abstract:
A semiconductor processing component includes a substrate and a layer overlying the substrate. The layer has a composition ReA y O 1.5+2y , wherein Re is Y, La, a Lanthanoid series element, or a combination thereof, A is (Si 1-a Ge a ), 0.25 y 1.2, and 0 a 1.
Abstract translation:半导体处理部件包括衬底和覆盖衬底的层。 该层具有组成,其中Re是Y,La,镧系元素,或它们的组合,A是(Si < 1-a sub> a sub>),0.25y 1.2和0 a 1。