公开(公告)号：US20240074058A1

公开(公告)日：2024-02-29

申请号：US18164748

申请日：2023-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAEKWANG LEE ,  HYUN A LEE ,  DOHYUNG KIM ,  DONGMIN JANG ,  JINWOO JANG

IPC: H05K1/11 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K1/117 ,  H05K3/18 ,  H05K3/28 ,  H05K1/09 ,  H05K2201/032 ,  H05K2201/0347 ,  H05K2201/09381 ,  H05K2201/099

Abstract: A module board includes a substrate having a wire pattern on a surface, a protection layer covering the surface of the substrate so as to expose one edge region of the substrate surface, and a plurality of tab terminals connected to the wire pattern and arranged on one edge region. Each tab terminal has a width larger than a width of the wire pattern. Each tab terminal has a pattern layer. A protection layer is on the pattern layer at a region where each tab terminal is connected to the wire pattern, and a plating layer is on a remainder of the pattern layer.