公开(公告)号：US20220059436A1

公开(公告)日：2022-02-24

申请号：US17520808

申请日：2021-11-08

Applicant: Samtec, Inc.

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L23/48 ,  H01L23/15 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H05K3/10 ,  H01L21/48 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：US11646246B2

公开(公告)日：2023-05-09

申请号：US16461970

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L29/40 ,  H01L29/06 ,  H01L23/48 ,  H01L21/00 ,  H01K3/10 ,  H01L23/15 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H05K3/10 ,  H01L21/48 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H05K1/16 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K3/00 ,  H01L23/367

CPC classification number: H01L23/481 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49883 ,  H05K3/101 ,  H05K3/102 ,  H05K3/107 ,  H05K3/4061 ,  H05K3/4076 ,  H05K3/4614 ,  H05K3/4629 ,  C03C2204/00 ,  C03C2205/00 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0029 ,  H05K3/403 ,  H05K3/423 ,  H05K2201/0272 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/09254 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/1006 ,  H05K2203/0182 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1461 ,  H05K2203/1476

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：US11251109B2

公开(公告)日：2022-02-15

申请号：US16461949

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L23/48 ,  H01L23/15 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H05K3/10 ,  H01L21/48 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H05K1/16 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K3/00 ,  H01L23/367

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.