公开(公告)号：WO0003436A3

公开(公告)日：2000-06-02

申请号：PCT/US9915595

申请日：1999-07-08

Applicant: SATCON TECHNOLOGY CORP

Inventor： COLELLO GARY M ,  HARTZELL DENNIS E

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40 ,  H01L23/24 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/043 ,  H01L23/12 ,  H01L23/34

CPC classification number: H05K1/0209 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K3/3447 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10401 ,  H05K2201/10962 ,  H01L2924/00

Abstract: A method for providing pre-placed, pre-brazed feed throughs in the substrate (4) of a hermetic package corresponding to the terminal leads (6b) of the encased circuit COTS components (6). The substrate (4) may include directly bonded copper (DBC) regions forming circular shapes (10) where the holes for the special connectors of the present invention will be located. These holes will correspond to the leads of the circuit component (6) that will be mounted to it. Holes are laser or mechanically drilled into the substrate (4) inside the circular shapes (10) formed in the DBC. To form the feed through, a bushing (12), such as a blind copper rivet, is brazed in the hole, with the open end thereof oriented toward the component-side of the substrate. These open ends can accept the leads of the circuit component (6), like the holes of a conventional PC circuit board.

Abstract translation: 一种用于在对应于被封装的电路COTS部件（6）的端子引线（6b）的密封封装的基板（4）中提供预置的预钎焊进料通道的方法。 基板（4）可以包括形成圆形（10）的直接接合的铜（DBC）区域，其中本发明的特殊连接器的孔将被定位。 这些孔对应于将被安装到其上的电路部件（6）的引线。 在DBC中形成的圆形（10）内部，孔被激光或机械地钻入基板（4）中。 为了形成进料通过，诸如盲铜铆钉的衬套（12）钎焊在孔中，其开口端朝向基板的部件侧。 这些开口端可以像常规PC电路板的孔那样接受电路部件（6）的引线。