公开(公告)号：DE3869656D1

公开(公告)日：1992-05-07

申请号：DE3869656

申请日：1988-05-13

Applicant: SGS THOMSON MICROELECTRONICS

Inventor： PALARA SERGIO ,  PERNICIARO SPATRISANO ANTONIO ,  PAPARO MARIO ,  GIACALONE PIETRO

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/52 ,  H01L25/04 ,  H01L25/07 ,  H01L25/18

Abstract: The circuit comprises several metal plates (A,B,C) onto each of which a chip (D,E,F) is soldered, the chips being connected together and to their respective rheophores (1,2.....9) by means of bonding wires. The plates and the other internal electrical components are reciprocally insulated by means of the resin which constitutes the encapsulation.