公开(公告)号：DE3884019D1

公开(公告)日：1993-10-21

申请号：DE3884019

申请日：1988-02-29

Applicant: SGS THOMSON MICROELECTRONICS

Inventor： PERNICIARO SPATRISANO ANTONIO ,  MINOTTI CARLO ,  GANDOLFI LUCIANO ,  DI CRISTINA NATALE

IPC: A61K39/175 ,  C12N7/06 ,  H01L21/50 ,  H01L23/495 ,  H01L25/065 ,  H01L25/04 ,  H01L23/52

Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates, and strips) and a one-piece frame designed to constitute the terminals (81-87). After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.

公开(公告)号：DE3869656D1

公开(公告)日：1992-05-07

申请号：DE3869656

申请日：1988-05-13

Applicant: SGS THOMSON MICROELECTRONICS

Inventor： PALARA SERGIO ,  PERNICIARO SPATRISANO ANTONIO ,  PAPARO MARIO ,  GIACALONE PIETRO

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/52 ,  H01L25/04 ,  H01L25/07 ,  H01L25/18

Abstract: The circuit comprises several metal plates (A,B,C) onto each of which a chip (D,E,F) is soldered, the chips being connected together and to their respective rheophores (1,2.....9) by means of bonding wires. The plates and the other internal electrical components are reciprocally insulated by means of the resin which constitutes the encapsulation.

公开(公告)号：DE3884019T2

公开(公告)日：1994-02-03

申请号：DE3884019

申请日：1988-02-29

Applicant: SGS THOMSON MICROELECTRONICS

Inventor： PERNICIARO SPATRISANO ANTONIO ,  MINOTTI CARLO ,  GANDOLFI LUCIANO ,  DI CRISTINA NATALE

IPC: A61K39/175 ,  C12N7/06 ,  H01L21/50 ,  H01L23/495 ,  H01L25/065 ,  H01L25/04 ,  H01L23/52

Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates, and strips) and a one-piece frame designed to constitute the terminals (81-87). After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.