公开(公告)号：US20200247970A1

公开(公告)日：2020-08-06

申请号：US16523753

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin CHEN ,  Qianfa LIU ,  Shanyin YAN ,  Xianping ZENG ,  Cuiming DU

IPC: C08J5/24 ,  C08L71/12 ,  C08L25/10 ,  C08L47/00 ,  H05K1/03 ,  B32B15/14

Abstract: A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

公开(公告)号：US20200247947A1

公开(公告)日：2020-08-06

申请号：US16523735

申请日：2019-07-26

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbin CHEN ,  Qianfa LIU ,  Shanyin YAN ,  Xianping ZENG ,  Cuiming DU

IPC: C08G65/329 ,  C08K5/14 ,  C08J5/24 ,  C08K9/04 ,  C08K7/26 ,  C08K3/38 ,  C08F236/06 ,  C08L53/02

Abstract: A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.

公开(公告)号：US20160229990A1

公开(公告)日：2016-08-11

申请号：US15028578

申请日：2013-10-11

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Cuiming DU ,  Liangpeng HAO ,  Songgang CHAI

IPC: C08K5/5398 ,  C08K5/05 ,  H05K1/03 ,  C08K3/22 ,  C08L63/00 ,  C08G59/06 ,  C08K5/39 ,  C08K3/36

CPC classification number: C08K5/5398 ,  B32B7/10 ,  B32B15/08 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/02 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/12 ,  B32B2307/30 ,  B32B2457/08 ,  C08G59/063 ,  C08G59/245 ,  C08G59/40 ,  C08G59/4021 ,  C08G59/686 ,  C08G77/12 ,  C08G77/20 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2483/04 ,  C08K3/22 ,  C08K3/36 ,  C08K5/05 ,  C08K5/39 ,  C08K2003/2227 ,  C08L61/04 ,  C08L63/00 ,  C08L83/04 ,  C08L2203/20 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0206 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/121 ,  C08K5/56 ,  C08K5/3445

Abstract: A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.

Abstract translation: 公开了一种包含热固性树脂，无机填料和有机钼化合物的热固性树脂组合物。 热固性树脂组合物可用于制备树脂消泡剂和预浸料坯，其中预浸料用于层压板和印刷电路板。