Abstract:
Provided is a photodetector 10 including: a plurality of photoelectric conversion elements 101 arranged within a photosensitive-element area 11 constituting one photosensitive element; the plurality of detection circuits 14 each of which is provided for one of the plurality of photoelectric conversion elements 101, each of the detection circuits including a capacitor 102; and a signal processing section 19 for totaling output signals produced by the plurality of detection circuits 14.
Abstract:
A plurality of photodiodes arrayed in a one-dimensional form are divided into a plurality of groups. The structure (the material and/or thickness of the coating) of an antireflection coating is changed for each group so that all the surfaces of the photodiodes belonging to each group are covered with an antireflection coating having a transmittance characteristic which shows a maximum transmittance within a range of wavelengths of light to be received by those photodiodes. In particular, a SiO 2 coating layer (104) on the silicon substrate (102) and an Al 2 O 3 coating layer (105) are common to all the photodiodes, while the structure of the upper layers are modified with respect to the wavelength. Within an ultraviolet wavelength region, the coating structure is more finely changed with respect to the wavelength. By such a design, the transmittance (the rate at which incident light reaches a photoelectric conversion region) can be improved while making the best efforts to avoid a complex manufacturing process. As a result, high levels of sensitivity can be achieved without omission even within the ultraviolet wavelength region in a spectrometric measurement system using a photodiode array detector.
Abstract:
PROBLEM TO BE SOLVED: To improve the detection sensitivity and an S/N of a solid state imaging element for extremely high-speed imaging at million frames per second and more without impairing imaging speed. SOLUTION: A floating diffusion (FD) region 13 is formed at the edge of a light receiving surface of an embedded photodiode, and with a transfer gate electrode 12 therebetween. A first region 111 with a radially extending section centered on the FD region 13, and a second region 112 located outside the first region are created in the roughly fan-shaped light receiving surface. Impurities of the same conductivity types as signal electrical charges collected in the first region 111 are introduced, thus forming an electric field which directs the signal electrical charge from the radially extending section toward the center according to the three-dimensional electric field effect. As a result, an electrical charge transfer time is reduced. Additionally, since a circuit element for a subsequent stage can be disposed adjacent to the FD region 13, the parasitic capacitance of the FD region 13 can be reduced and a highly-sensitive element can be obtained. COPYRIGHT: (C)2011,JPO&INPIT