公开(公告)号：EP1360067A4

公开(公告)日：2004-06-23

申请号：EP01990176

申请日：2001-12-11

Applicant: SHRI DIKSHA CORP

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B27/12 ,  D03D15/00

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs (124), laminates (120, 122), printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins (132). In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

公开(公告)号：AU2904202A

公开(公告)日：2002-06-24

申请号：AU2904202

申请日：2001-12-11

Applicant: SHRI DIKSHA CORP

Inventor： VASOYA KALU K ,  MANGROLIA BHARAT M ,  DAVIS WILLIAM E ,  BOHNER RICHARD A

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/04 ,  C08K3/38 ,  C08K9/08 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  B32B27/12 ,  D03D15/00

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.