Recubrimiento, artículo y método de deposición química de vapor

    公开(公告)号:ES2859458T3

    公开(公告)日:2021-10-04

    申请号:ES10771619

    申请日:2010-10-26

    Applicant: SILCOTEK CORP

    Abstract: Un método (200) de deposición química de vapor térmica, comprendiendo el método (200): la preparación de (202) un sustrato (100) en una cámara de deposición química de vapor; la descomposición térmica (204) de dimetilsilano en la cámara de deposición química de vapor para formar un recubrimiento (102), realizándose la descomposición térmica en ausencia de energías de deposición adicionales, tales como campos de plasma y microondas, y en las siguientes condiciones: - a una presión de entre 6,8948x10-3 MPa (6,8948x10-2 bar (1,0 l.p.c.a.)) y 0,68948 MPa (6,8948 bar (100 l.p.c.a.)), preferentemente a una presión de entre 3,4474x10-2 MPa (3,4474x10-1 bar (5 l.p.c.a.)) y aproximadamente 0,27579 MPa (2,7579 bar (40 l.p.c.a.)); y - a una temperatura de entre 300 °C y 600 °C; y - durante un tiempo de 30 minutos a 24 horas.

    Diffusion-rate-limited thermal chemical vapor deposition coating

    公开(公告)号:AU2017200337A1

    公开(公告)日:2017-08-10

    申请号:AU2017200337

    申请日:2017-01-18

    Applicant: SILCOTEK CORP

    Abstract: Thermal chemical vapor deposition coated articles and thermal chemical vapor deposition processes are disclosed. The article includes a substrate and a thermal chemical vapor deposition coating on the substrate. The thermal chemical vapor deposition coating includes properties from being produced by diffusion-rate-limited thermal chemical vapor deposition. The thermal chemical vapor deposition process includes introducing a gaseous species to a vessel and producing a thermal chemical vapor deposition coating on an article within the vessel by a diffusion-rate-limited reaction of the gaseous species. 107--,,. 115

    Thermal chemical vapor deposition split-functionalization process, product, and coating

    公开(公告)号:AU2016253571A1

    公开(公告)日:2017-05-25

    申请号:AU2016253571

    申请日:2016-11-02

    Applicant: SILCOTEK CORP

    Abstract: THERMAL CHEMICAL VAPOR DEPOSITION SPLIT FUNCTIONALIZATION PROCESS, PRODUCT, AND COATING Thermal chemical vapor deposition split-functionalizing processes, coatings, and products are disclosed. The thermal chemical vapor deposition split-functionalizing process includes positioning an article within an enclosed chamber, functionalizing the article within a first temperature range for a first period of time, and then further functionalizing the article within a second temperature range for a second period of time. The thermal chemical vapor deposition split-functionalized product includes a functionalization formed by functionalizing within a first temperature range for a first period of time and a further functionalization formed by further functionalizing within a second temperature range for a second period of time. -12-

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