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    THROUGH SUBSTRATE VIAS AND DEVICE
    1.
    发明申请
    THROUGH SUBSTRATE VIAS AND DEVICE 审中-公开
    通过基板VIAS和设备

    公开(公告)号：WO2014070091A2

    公开(公告)日：2014-05-08

    申请号：PCT/SE2013051273

    申请日：2013-10-31

    Applicant: SILEX MICROSYSTEMS AB

    Inventor： ERLESAND ULF ,  KÄLVESTEN EDVARD

    IPC: H01L21/768

    CPC classification number: H01L23/15 ,  B81B7/007 ,  B81C1/00095 ,  C25D5/02 ,  H01L21/50 ,  H01L21/76879 ,  H01L23/49827 ,  H01L23/49872 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The invention relates to a method of making through-substrate-vias in glass substrates. A first substrate (10) is provided on which a plurality of needles (11) protruding vertically from the substrate are made. A second substrate (14) made of glass is then provided. The substrates are located adjacent each other such that the needles on the first substrate face the second substrate. Heat is applied to a temperature where the glass softens, by heating the glass or the needle substrate or both. A force (F) is applied such that the needles on the first substrate penetrate into the glass to provide impressions in the glass. Finally, the first substrate is removed and material filling the impressions in the second substrate made of glass is provided. There is also provided a device, comprising a silicon substrate (100; 200). There is a cavity (102) in which a MEMS component (104) is accommodated, and a cap wafer (300) made of a material having a low dielectric constant, preferably glass. The cap wafer has through substrate vias of metal, and is bonded to the silicon substrate.

    Abstract translation: 本发明涉及在玻璃衬底中制造穿透衬底通孔的方法。 提供第一基板（10），在该第一基板（10）上制造从基板垂直突出的多个针（11）。 然后提供由玻璃制成的第二衬底（14）。 衬底彼此相邻定位，使得第一衬底上的针面向第二衬底。 通过加热玻璃或针状基体或两者，加热到玻璃软化的温度。 施加力（F）使得第一基底上的针穿透玻璃以在玻璃中提供印痕。 最后，去除第一衬底并提供填充由玻璃制成的第二衬底中的印痕的材料。 还提供了一种包括硅衬底（100; 200）的器件。 存在其中容纳有MEMS部件（104）的空腔（102）以及由具有低介电常数的材料（优选为玻璃）制成的盖晶片（300）。 盖晶片具有穿过金属的衬底通孔，并且被结合到硅衬底。

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