Abstract:
PROBLEM TO BE SOLVED: To provide an anodization apparatus suitable for automatization and a batch process, and having a mechanism by which a substrate is held, transferred, and made into a part of an anodization tank, and a semiconductor substrate having a porous layer formed.SOLUTION: A plurality of substrates W are moved to a processing position while held by a left holder part 67 and a right holder part 69, and connected to an upper holder part 71 and a lower holder part 39, and then the whole circumferential surfaces of the plurality of substrates W are liquid-tight with an electrolyte solution in a reservoir 11. In this state, anodization processing is performed, and then the substrates W are discharged from the reservoir 11. Thus, the left holder part 67 and the right holder part 69 are structured along with the upper holder part 71 and the lower holder part 39 so as to be able to hold the substrates W in a liquid-tight state. Therefore, the anodization apparatus 1 suitable for automatization and a batch process is achieved, by which the plurality of the substrates W are transferred, and porous layers are formed. Also, according to the apparatus, the semiconductor substrate including porous layers efficiently and uniformly formed on both surfaces, the front and rear surfaces, can be provided.
Abstract:
A METHOD IS PROVIDED FOR FABRICATING A THIN-FILM SEMICONDUCTOR SUBSTRATE (54) BY FORMING A POROUS SEMICONDUCTOR LAYER (52) CONFORMALLY ON A REUSABLE SEMICONDUCTOR TEMPLATE (50) AND THEN FORMING A THIN-FILM SEMICONDUCTOR SUBSTRATE (54) CONFORMALLY ON THE POROUS SEMICONDUCTOR LAYER (52). AN INNER TRENCH (62) HAVING A DEPTH LESS THAN THE THICKNESS OF THE THIN-FILM SEMICONDUCTOR SUBSTRATE (54) IS FORMED ON THE THIN-FILM SEMICONDUCTOR SUBSTRATE (54). AN OUTER TRENCH (68) PROVIDING ACCESS TO THE POROUS SEMICONDUCTOR LAYER (52) IS FORMED ON THE THIN-FILM SEMICONDUCTOR SUBSTRATE (54) AND IS POSITIONED BETWEEN THE INNER TRENCH (62) AND THE EDGE OF THE THIN-FILM SEMICONDUCTOR SUBSTRATE (54). THE THIN-FILM SEMICONDUCTOR SUBSTRATE IS THEN RELEASED FROM THE REUSABLE SEMICONDUCTOR TEMPLATE (50).
Abstract:
Methods for manufacturing three-dimensional thin- film solar cells 100, using a template. The template comprises a template substrate comprising a plurality of posts and a plurality of trenches between said plurality of posts. The three-dimensional thin-film solar cell substrate is formed by forming a sacrificial layer on the template, subsequently depositing a semiconductor layer, selectively etching the sacrificial layer, and releasing the semiconductor layer from the template. The resulting three-dimensional thin-film solar cell substrate may comprise a plurality of single-aperture unit cells or dual-aperture unit cells. Select portions of the three-dimensional thin-film solar cell substrate are then doped with a first dopant, while other select portions are doped with a second dopant. Next, emitter 525 and base metallization regions 532 are formed.
Abstract:
Solar module structures and methods for assembling solar module structures. The solar module structures comprise pyramidal three-dimensional thin-film solar cells arranged in solar module structures. The pyramidal three-dimensional thin-film solar cell comprises a pyramidal three-dimensional thin-film solar cell substrate with emitter junction regions and doped base regions. The three-dimensional thin-film solar cell further includes emitter metallization regions and base metallization regions. The three-dimensional thin-film solar cell substrate comprises a plurality of pyramid-shaped unit cells. The solar module structures may be used in solar glass applications, building facade applications, rooftop installation applications as well as for centralized solar electricity generation.
Abstract:
A back contact solar cell is described which includes a semiconductor light absorbing layer; a first-level metal layer (Ml), the Ml metal layer on a back side of the light absorbing layer, the back side being opposite from a front side of the light absorbing layer designed to receive incident light; an electrically insulating backplane sheet backside of said solar cell with the Ml layer, the backplane sheet comprising a plurality of via holes that expose portions of the Ml layer beneath the backplane sheet; and an M2 layer in contact with the backplane sheet, the M2 layer made of a sheet of pre-fabricated metal foil material comprising a thickness of between 5-250 μm, the M2 layer electrically connected to the Ml layer through the via holes in the backplane sheet.