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    Epoxy resin composition
    1.
    发明公开
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号：EP0348193A3

    公开(公告)日：1990-09-12

    申请号：EP89306298.4

    申请日：1989-06-22

    Applicant: SOMAR CORPORATION

    Inventor： Akutagawa, Ichiro ,  Matsuzaki, Kunimitsu ,  Matsuo, Toshio ,  Shirose, Toru

    IPC: C08G59/24 ,  C08L71/02 ,  H01B3/40 ,  C08G59/40

    CPC classification number: H01B3/40 ,  C08G59/42 ,  C08G59/686 ,  C08L63/00 ,  C08L2666/22

    Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:
    (A) a mixture containing
    (a₁) a liquid, Bisphenol-type epoxy resin, and (a₂) an inorganic filler, (a₃) a polyether polyol; and (B) a liquid curing agent including
    (b₁) an acid anhydride, and (b₂) an imidazole compound.

    Abstract translation: 公开了一种适合用作灌注点火线圈的浇铸树脂的环氧树脂组合物，它包括：（A）含有（a 1）液体，双酚型环氧树脂和（a 2）无机填料，（ a 3）聚醚多元醇; 和（B）含有（b 1）酸酐和（b 2）咪唑化合物的液体固化剂。

    Method of forming electrically conducting layer
    2.
    发明公开
    Method of forming electrically conducting layer 失效
    形成电导体层的方法

    公开(公告)号：EP0381900A3

    公开(公告)日：1992-04-15

    申请号：EP89313682.0

    申请日：1989-12-28

    Applicant: SOMAR CORPORATION

    Inventor： Fujii, Ryuichi ,  Ogitani, Osamu 807, Mitsui-Sengendai Height ,  Shirose, Toru

    IPC: G03F7/032

    CPC classification number: G03F7/032 ,  H05K3/0023 ,  H05K3/4652 ,  H05K3/4661 ,  H05K3/4676

    Abstract: A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of:
    (a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator; (b) applying the composition to the conducting surface to form a coated layer; (c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer, (d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and (e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).

    Epoxy resin composition
    3.
    发明公开
    Epoxy resin composition 失效
    Epoxydharzzusammensetzung。

    公开(公告)号：EP0348193A2

    公开(公告)日：1989-12-27

    申请号：EP89306298.4

    申请日：1989-06-22

    Applicant: SOMAR CORPORATION

    Inventor： Akutagawa, Ichiro ,  Matsuzaki, Kunimitsu ,  Matsuo, Toshio ,  Shirose, Toru

    IPC: C08G59/24 ,  C08L71/02 ,  H01B3/40 ,  C08G59/40

    CPC classification number: H01B3/40 ,  C08G59/42 ,  C08G59/686 ,  C08L63/00 ,  C08L2666/22

    Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:

    (A) a mixture containing

    (a₁) a liquid, Bisphenol-type epoxy resin, and
    (a₂) an inorganic filler,
    (a₃) a polyether polyol; and

    (B) a liquid curing agent including

    (b₁) an acid anhydride, and
    (b₂) an imidazole compound.

    Abstract translation: 公开了一种适用于点燃线圈灌封的浇铸树脂的环氧树脂组合物，其包括：（A）含有（a1）液体，双酚型环氧树脂和（a2）无机填料的混合物（ a3）聚醚多元醇; 和（B）包含（b1）酸酐和（b2）咪唑化合物的液体固化剂。 F

    Laminate film having a thermocurable resin layer
    6.
    发明公开
    Laminate film having a thermocurable resin layer 失效
    Laminatfilm mit einerwärmehärtbarenHarzschicht。

    公开(公告)号：EP0488705A1

    公开(公告)日：1992-06-03

    申请号：EP91310980.7

    申请日：1991-11-28

    Applicant: SOMAR CORPORATION

    Inventor： Ogitani, Osamu, 807, Mitsuisengendai Heights ,  Kawashima, Masao ,  Shirose, Toru ,  Fujii, Ryuichi

    IPC: G03F7/038 ,  H05K3/00

    CPC classification number: H05K3/0076 ,  G03F7/038 ,  H05K2203/066

    Abstract: A laminate film is disclosed which includes a substrate film and a photocurable resin film formed of a photocurable epoxy resin, a photopolymerization catalyst and a phenoxy or butyral resin and supported on one surface of the substrate film. The laminate film is useful for forming an electrically insulating layer over a conducting surface by transference of the photocurable resin film to the conducting surface.

    Abstract translation: 公开了一种层压膜，其包括基材膜和由光固化环氧树脂，光聚合催化剂和苯氧基或缩丁醛树脂形成的可光固化的树脂膜，并且负载在基材膜的一个表面上。 通过将光固化树脂膜转移到导电表面，层压膜可用于在导电表面上形成电绝缘层。

    Method of forming electrically conducting layer
    7.
    发明公开
    Method of forming electrically conducting layer 失效
    Verfahren zur Herstellung einer elektronenleitenden Schicht。

    公开(公告)号：EP0381900A2

    公开(公告)日：1990-08-16

    申请号：EP89313682.0

    申请日：1989-12-28

    Applicant: SOMAR CORPORATION

    Inventor： Fujii, Ryuichi ,  Ogitani, Osamu 807, Mitsui-Sengendai Height ,  Shirose, Toru

    IPC: G03F7/032

    CPC classification number: G03F7/032 ,  H05K3/0023 ,  H05K3/4652 ,  H05K3/4661 ,  H05K3/4676

    Abstract: A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of:

    (a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator;
    (b) applying the composition to the conducting surface to form a coated layer;
    (c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer,
    (d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and
    (e) forming an electrically conducting layer on the cured resin layer.

    Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).

    Abstract translation: 通过包括以下步骤的方法，在诸如印刷电路板的导电表面上形成诸如附加布线图案或电磁绝缘层的导电层，其间具有绝缘层，方法包括：（a）提供液体 含有环氧树脂，固化剂，具有至少两个丙烯酸酯或甲基丙烯酸酯基团的聚合性化合物和光聚合引发剂的热固性组合物; （b）将组合物施加到导电表面以形成涂层; （c）在涂层上照射光化学光以聚合可聚合化合物并获得固体热固性层，（d）加热热固性层以固化环氧树脂并形成绝缘层; 和（e）在固化树脂层上形成导电层。 重复步骤（b）和（c），直到固体热固化层具有所需的厚度。 步骤（d）可以在步骤（e）之前或之后进行。

    Thermosetting composition
    9.
    发明公开
    Thermosetting composition 失效
    热固性组合物

    公开(公告)号：EP0381899A2

    公开(公告)日：1990-08-16

    申请号：EP89313681.2

    申请日：1989-12-28

    Applicant: SOMAR CORPORATION

    Inventor： Fujii, Ryuichi ,  Ogitani, Osamu 807, Mitsui-Sengendai Height ,  Shirose, Toru

    IPC: C08F283/10 ,  C08F283/00 ,  C08G59/40

    CPC classification number: C08F283/00 ,  C08F283/10 ,  H05K3/285 ,  H05K3/287 ,  C08F220/12

    Abstract: A liquid, thermosetting composition is disclosed which contains (a) 10-70 % by weight of an epoxy resin, (b) 10-70 % by weight of a maleimide-triazine resin, (c) 5-60 % by weight of a polymerizable compound having at least two acrylate or methacrylate groups, and (d) 0.1-10 % by weight of a radical polymerization initiator, the amount of each of ingredients (a) through (d) being based on the total weight of ingredients (a) through (c). The composition gives a solid, thermosetting resin when heated at a low temperature or when irradiated by actinic light by reaction of ingredients (c) and (e), and the solidified resin in turn affords a cured resin having good moisture-­proofing and insulting properties when heated at a high temperature by reaction of ingredients (a) and (b).

    Abstract translation: 公开了一种液体热固性组合物，其含有（a）10-70重量％的环氧树脂，（b）10-70重量％的马来酰亚胺 - 三嗪树脂，（c）5-60重量％的 （d）0.1-10重量％的自由基聚合引发剂，各成分（a）至（d）的量基于成分 ）到（c）。 当组分在低温加热下或当通过成分（c）和（e）的反应由光化射线照射时得到固体热固性树脂，并且固化的树脂又提供具有良好防潮性和绝缘性的固化树脂 当通过成分（a）和（b）的反应在高温下加热时。

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