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公开(公告)号：JPH09204608A
公开(公告)日：1997-08-05
申请号：JP3268196
申请日：1996-01-25
Applicant: SONY CORP
Inventor： SHIBATA KEIICHI , CHIBA YUICHI , ARAI MASAYA
Abstract: PROBLEM TO BE SOLVED: To align tracks with high accuracy, and to improve productive efficiency by detecting the places of the tracks of each head and mutually aligning the tracks of each head. SOLUTION: Each head of a magnetic head consisting of a plurality of heads is held to a holding section 13, and the holding section 13 is installed to a support section 12. The holding section 13 is moved in the XY directions of the support section 12 from the state. The places of the tracks of each held head are detected by a detecting section 14, and the tracks of each held head are aligned mutually so that the places of the tracks of each head are aligned mutually. The holding section 13 is removed from the support section 12, and each head is bonded and fixed mutually with adhesives by a bonding section.
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公开(公告)号：JP2001216752A
公开(公告)日：2001-08-10
申请号：JP2000027337
申请日：2000-01-31
Applicant: SONY CORP
Inventor： OYA HITOSHI , YAMAUCHI MASAYA , CHIBA YUICHI , CHIBA MASAHIRO
IPC: G11B21/21
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a magnetic head device for improving positioning and bonding precision to the elastic supporting member of a head slider and the magnetic head device. SOLUTION: This method for manufacturing a magnetic head comprises a head slider mounting process for mounting a head slider 11 equipped with a magnetic head element for recording and/or reproducing information for a medium on a mounting part 12a of an elastic supporting member 12. This method also comprises a mounting part reference position detecting process for detecting the reference position of the mounting part of the elastic supporting member, a head slider reference position detecting process for detecting the reference position based on the shape of one part of the head slider, an integrating process for integrating the relative positions of the reference positions of the mounting part of the elastic supporting member and the head slider which are respectively detected by the mounting part reference position detecting process and the head slider reference position detecting process, and a bonding process for mutually bonding the elastic supporting member and the head slider.
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公开(公告)号：JP2000123313A
公开(公告)日：2000-04-28
申请号：JP29718798
申请日：1998-10-19
Applicant: SONY CORP
Inventor： YAMAUCHI MASAYA , CHIBA YUICHI , HAYASAKA SHUJI
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for a magnetic head which is capable of producing the magnetic head with high accuracy and improving productivity. SOLUTION: This manufacturing method is executed by joining a pair of magnetic core block halves 24a, 24b to form a magnetic core block 24, machining one face 25 of the magnetic core block 24 by grinding to a curved surface, cutting the magnetic core block 24 toward the vertical direction of the joined surface to the thickness of the magnetic head, thereby forming the magnetic head. In such a case, a measuring groove 30 with a fixed width L and a fixed depth d1 is formed along the joined surface on the one face of the magnetic core block 24 and the measuring groove 30 is provided with a measuring member 31. By such a constitution, grinding is carried out while measuring the amt. of grinding in accordance with the width L of the measuring member 31.
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公开(公告)号：JPH07176007A
公开(公告)日：1995-07-14
申请号：JP31835593
申请日：1993-12-17
Applicant: SONY CORP
Inventor： CHIBA YUICHI
IPC: G11B5/127
Abstract: PURPOSE:To convert a small-sized head device to the outside shape size of a large-sized head device so as to enable the diversion of production equipment for the current large-sized head devices to production of the small-sized head devices. CONSTITUTION:A dummy base 20 having the same width Wa as the width of a large-sized head space 2 of the large-sized head device 1 is used and a small-sized head base 12 is precisely aligned and joined thereon. The small-sized head device 10 is produced with the existing production equipment for the large-sized head devices by using such joined base. Then, the utilization of the existing production equipment is possible and, therefore, the start of production of these devices in a relatively short period of time is possible and the production cost is reduced.
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公开(公告)号：JP2002343823A
公开(公告)日：2002-11-29
申请号：JP2001144425
申请日：2001-05-15
Applicant: SONY CORP
Inventor： CHIBA YUICHI , NAKAMURA ATSUSHI , KAYABA SHINJI , HORII SHINICHI
Abstract: PROBLEM TO BE SOLVED: To lessen the projecting amount of a wire material from a semiconduc tor chip by adjusting the bonding order of an electrode located at a high posi tion and that located at a low position. SOLUTION: A method is provided for connecting an electrode 9 on the semiconductor chip 4 with an electrode 15a located at a position lower than the electrode formation surface of the chip 4 by a wire bonding. The electrode 15a is connected with the electrode 9 by a first bonding, and the electrode 9 on the chip 4 is connected with the electrode 15a by a second (subsequent to the first) bonding.
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Patent Agency Ranking
公开(公告)号：JP2001216617A
公开(公告)日：2001-08-10
申请号：JP2000027338
申请日：2000-01-31
Applicant: SONY CORP
Inventor： CHIBA YUICHI , YAMAUCHI MASAYA , CHIBA MASAHIRO , OYA HITOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a head slider assembling method and a magnetic head device, capable of facilitating the sure electric grounding of a head slider to an elastic supporting member, and performing the easy verification of the grounding by a conductive material. SOLUTION: This magnetic head manufacturing method comprises a head slider attaching process for attachment to a head slider 11 provided with a magnetic head element for recording and/or reproducing information in a medium. The head slider attaching process includes the adhesive coating step of coating adhesive 20 to the adhesive part of the attaching part of the head slider and/or an elastic supporting member, the conductive material coating step of coating conductive materials 21 and 21a, and the adhering step of adhering these, and in the conductive material coating step, the conductive materials are coated so as to protrude out from the adhesive parts by proper amounts after the adhering step.
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公开(公告)号：JPH07182615A
公开(公告)日：1995-07-21
申请号：JP32291693
申请日：1993-12-21
Applicant: SONY CORP
Inventor： CHIBA YUICHI , MATSUNO FUMIO
Abstract: PURPOSE:To improve the flatness of grinding in a gap depth surface. CONSTITUTION:In a long-sized magnetic core block 1 with a magnetic gap G formed on one plane, the surface at a certain angle of a surface 3 where the magnetic gap is formed is ground planar along the length of the magnetic gap. Other angle surfaces of the magnetic gap forming surface 3 undergo this planar grinding to finish the magnetic gap forming surface 3 as a specified magnetic gap depth D by accomplishing a grinding over multiple surfaces. This makes possible the elimination of variations in gap depth finish dimensions almost completely in a working core block and also allows the use of the same apparatus and jig in the working of core blocks for individual magnetic head apparatuses varied in R shape.
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公开(公告)号：JPH07260409A
公开(公告)日：1995-10-13
申请号：JP7655994
申请日：1994-03-23
Applicant: SONY CORP
Inventor： HASEGAWA MASAHARU , CHIBA YUICHI
Abstract: PURPOSE:To provide method and apparatus for positioning a work accurately at a predetermined positron on a reference plane in which positional shift can be detected instantaneously. CONSTITUTION:The work positioning apparatus comprises three reference pins 12, 13, 14 projecting upward from predetermined positions on a reference plane 11a, a fixing means 15 supported movably up and down above the reference plane 11a, means 16 for driving the fixing means 15 up and down, and a control circuit for detecting electrical conduction between three reference pins and operating the driving means 16.
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公开(公告)号：JPH07178675A
公开(公告)日：1995-07-18
申请号：JP32741393
申请日：1993-12-24
Applicant: SONY CORP
Inventor： HASEGAWA MASAHARU , CHIBA YUICHI
Abstract: PURPOSE:To shorten a working time while preventing a workpiece from chipping by forming a plurality of fine through holes in a side surface peripheral part of a rotary grinding wheel, so that a temperature rise of the grinding wheel and the workpiece can be relaxed. CONSTITUTION:This grinding wheel 1 fixed to a flange 3 of a rotary shaft of a motor is formed into a doughnut type disk shape, and a plurality of fine through holes 2 are formed over the total periphery in the vicinity of a side surface peripheral part of the grinding wheel. By rotating this grinding wheel 1 at a high speed in the clockwise direction Y and also by moving an X-axis table 10 in an X direction while injecting grinding water from a jet port 4A of a pair of nozzles 4, a workpiece W is ground to be cut by the grinding wheel 1. Here, since grinding water 5, accumulated in the through hole 2 of the grinding wheel 1, not only cools the grinding wheel 1 itself but also advances one after another into a cut part of the workpiece W, to also cool a cut surface, discharging cutting chips to the outside can be smoothed while maintaining sharpness improved of the grinding wheel 1.
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公开(公告)号：JPH07142856A
公开(公告)日：1995-06-02
申请号：JP29227893
申请日：1993-11-22
Applicant: SONY CORP
Inventor： SUGAWARA MITSUHARU , SATO IKUO , CHIBA YUICHI , MORI OSAMU
Abstract: PURPOSE:To reduce the processes of soldering and perform the connection by soldering without fail. CONSTITUTION:Both terminals of an insulated wire 13 wound on a magnetic head 11 are extended to the solder land 15 of an electronic circuit arranged near this magnetic head tip 11 as they are without stripping the insulation 13 of a lead wire, and from above a heater tip is put and specified load is applied, and then the heater is supplied with a current for heating, and the insulation of the lead wire is broken, whereby the insulation of the lead wire breaks easily, and the exposed lead wire can be connected to a solder land surely, and electric continuity can be obtained. Moreover, the necessity to temporarily fixing the lead wire covered with an insulation in the process before soldering is eliminated.
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