Abstract:
Disclosed is a micromachine as a high-frequency filter which includes a high Q value and is suitable for higher frequency bands. The micromachine (1) includes an output electrode (7) formed on a substrate (5), an interlayer insulating film (9) which covers the substrate (5) and includes an opening (9a) whose bottom is the output electrode (7), and a beltlike resonator electrode (11) so formed on the interlayer insulating film (9) as to traverse above the space (A) in the opening (9a), with the resonator electrode (11) being concave toward the opening (9a) along the side wall of the opening (9a).
Abstract:
A micromachine for a high frequency filter having a high Q factor and a frequency band which is high. A micromachine (1) comprising an output electrode (7) disposed on a board(5), an interlayer insulation film (9) covering the board (5) and having a hole pattern (9a) with an output electrode (7) used as a bottom, and a band-like vibrator electrode (11) disposed on the interlayer insulation film (9) in such a manner that, with the interior of the hole pattern (9a) used as a space (A), it crosses the upper region thereof, the micromachine being characterized in that the vibrator electrode (11) is formed as a recess on the hole pattern (9a) side along the side wall of hole pattern (9a).
Abstract:
PROBLEM TO BE SOLVED: To provide a micro capacitor capable of changing capacity by simple constitution, and securing and stabilizing the capacity. SOLUTION: The micro capacitor is provided with capacitors 11, 12 constituting a plurality of capacitors C, a dielectric film, a driving electrode 14, and a single power supply and constituted so that the lengths L1 of the displacing positions of respective electrode 11P in the capacity 11 is coincident with each other, and the lengths L2 of respective driving electrodes 14A in the driving electrode 14 are mutually different. When voltage to be applied from the single power supply to the driving electrode 14 is gradually changed in each of the driving electrodes 14A, the micro capacitor is successively switched based on differences of pull-In voltages among respective capacitors, thus changing the capacity. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To optimize the beam inclination amount while restraining the bending of a beam even if the beam is made micro-sized in a micro electromechanical element requiring an inclination in the surface shape of the beam. SOLUTION: A lower electrode 43 is provided with a beam 45 opposite thereto through a space 44 and supported at the end parts, and the beam 45 is provided with a step 51 for causing inclination in the width direction of the beam. The step 51 is provided with a means 52 for relaxing the stress of a triple point. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a micro-structure, easily forming a sealed structure using a semiconductor process, and a micro electro mechanical system. SOLUTION: An enveloping wall part 48 is formed to enclose a micro electro mechanical system body 46 on a substrate 42, and an upper film 49 lowered due to film characteristic is made to closely adhere to the top face of the enveloping wall part 48, thereby sealing the micro electro mechanical system body 46. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a leak cut-off switch reduced in on-resistance is obtained in a small size, and to provide a leak control circuit. SOLUTION: In the semiconductor device, a switching means 3 is installed with a driving power source of a circuit block 2 or the ground and an unnecessary leak current is interrupted by bringing the switching means 3 into an off-state in a standby state. In the semiconductor device or the leak control circuit, the switching means 3 is operated by contact and non-contact switching by the mechanical operation of a movable part 8 formed of a conductive electrode existing on the same chip as the circuit block 2. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a superior ferroelectric memory element without characteristic variations. SOLUTION: A crystalline insulating film 11 formed with crystalline metal oxide insulates electrically a lower electrode 10a from a lower electrode 10b formed on other memory cell and forms a flat surface along with the lower electrode 10a and the other lower electrode 10b, and a ferroelectric thin film 12 is formed on this flat surface. Because the crystalline insulating film 11 consists of the crystalline metal oxide, the difference between coefficients of thermal expansion of the crystalline insulating film 11 and the ferroelectric thin film 12 is small, and further because the ferroelectric thin film 12 is formed on the flat surface, the ferroelectric thin film 12 can be formed in a state that the crystalline property and the morphology are uniform. As a result, a ferroelectric memory element 1 of a cross point type, which has the superior ferroelectric capacitor without characteristic variations, can be obtained.
Abstract:
PROBLEM TO BE SOLVED: To prevent a contact failure and a degradation in transistor characteristics from occurring in a semiconductor memory device, by a method wherein a diffusion barrier layer, which is thermally stable, electrically conductive, and high in barrier properties to oxygen, the component elements of plug material, and lower electrode of precious metal, is provided between the plug and the lower electrode. SOLUTION: A semiconductor memory device 10 is equipped with a dielectric capacitor 31 composed of a first electrode (lower electrode) 32, a dielectric film 33, and a second electrode (upper electrode) 34; and a conductive plug 15 connected to the lower electrode 32. The lower electrode 32 connected to the conductive plug 15 is equipped with a conductive metal lower oxide layer 51, and a diffusion barrier layer 52 which stops diffusion of oxygen. The oxide layer 51 and the diffusion barrier layer 52 are laminated on the conductive plug 51 in this sequence.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor package which maintains good electromagnetic compatibility with a printed substrate by conducting easy and inexpensive processes, and to provide a method for manufacturing the semiconductor package and an optical module.SOLUTION: A camera module 1 is formed by mounting a lens unit 20 on a wafer level package 10, and the wafer level package 10 has a light receiving element 15 and electrode pads 13, which are sealed with a glass substrate 11, on a front surface of a support substrate 14. Solder balls 17 are formed on a rear surface side of the support substrate 14. The solder balls 17 are electrically connected with the electrode pads 13 by through vias 14a, which are provided so as to penetrate through the support substrate 14, and a re-wiring layer 16. An entire side surface of the camera module 1 is painted by an electromagnetic light exclusion shield film 30b, and thereby suppressing the occurrence of electromagnetic interference with a printed substrate on which the camera module is mounted.
Abstract:
PROBLEM TO BE SOLVED: To provide a resonance transistor or more materially a beam type resonance bulk transistor and a beam type resonance thin film transistor which permit high frequency, high SN ratio, and high power by employing a micro resonator. SOLUTION: The resonance transistor 1 is provided with a drain region 4, a source region 2, a channel region 3, and a gate oscillator 5 provided on the channel region 3 so as to be opposed through a space 16. A drain current, made to flow through the drain region 4, is changed in an AC waveform by the resonance of the gate oscillator 5. COPYRIGHT: (C)2006,JPO&NCIPI