Abstract:
Provided is a method of manufacturing a display unit capable of manufacturing a large-screen display unit with high display quality without upsizing manufacturing facilities. Device substrates (10A, 10B) on which a pixel 12 including organic light-emitting device 12R, 12G, 12B is formed are aligned on the same plane so as to face a sealing substrate 20. While the device substrates and the sealing substrate are bonded together with an adhesive resin 30 for sealing in between, the adhesive resin for sealing is extruded from a seam portion 11 to the backside of the seam portion so as to fill the seam portion with the adhesive resin for sealing. The backside of the seam portion can be securely sealed through a simple step. The method is suitable for a large-scale display unit using top-emitting organic light-emitting devices. A back sealing member may be disposed on the backside of the seam portion with the extruded adhesive resin for sealing in between. After that, the adhesive resin for sealing is cured.
Abstract:
A method of manufacturing a display unit capable of manufacturing a large-screen display unit with high display quality without upsizing manufacturing facilities is provided. Device substrates on which a pixel including the organic light-emitting devices is formed are aligned on the same plane so as to face a sealing substrate. While the device substrates and the sealing substrate are bonded together with an adhesive resin for sealing in between, the adhesive resin for sealing is extruded from a seam portion to the backside of the seam portion so as to fill the seam portion with the adhesive resin for sealing. The backside of the seam portion can be securely sealed through a simple step. The method is suitable for a large-scale display unit using top-emitting organic light-emitting devices. A back sealing member may be disposed on the backside of the seam portion with the extruded adhesive resin for sealing in between. After that, the adhesive resin for sealing is cured.
Abstract:
PROBLEM TO BE SOLVED: To achieve differentiation coating for a vapor-depositable material capable of obtaining a display of high quality without using a mask for vapor deposition. SOLUTION: Vapor deposition molecules evaporated from a vapor deposition source 62 are allowed to reach the object 32 to be vapor-deposited in a vacuum vessel, so as to form a thin film on the object 32 to be vapor-deposited by the vapor deposition molecules. The vacuum deposition method includes: a charging step where the vapor deposition molecules are charged, so as to be charges e - before the vapor deposition molecules reach the object 32 to be vapor-deposited; and an application step where at least either the application of voltage with positive polarity different from the charge polarity of the vapor deposition molecules to an electrode R arranged correspondingly to the part at which the thin film is formed or the application of voltage with negative polarity same as the charge polarity of the vapor deposition molecules to electrodes G, B arranged correspondingly to the part at which the thin film is not formed is performed. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a high performance thin film magnetic recording head capable of high density recording, which has a narrow tip to fit a narrow recording track while suppressing the fringing magnetic field from other parts of the head, and its manufacturing method. SOLUTION: This thin film recording head 10 consists of a coil 3 disposed at least apart from the lower magnetic pole 1 and the upper magnetic pole 2 which have their tips 1A, 2A to form the sliding surfaces 1B, 2B fitting the recording track width, and rear parts 1C, 2C formed back the depth zero line 2D(Dp 0). After forming the lower pole 1 and the upper pole 2, focused ion beam etching is applied to trim them from the sliding surface to back the depth zero line except their tips 1A, 2A made to fit the recording track in width, to manufacture this head.
Abstract:
PURPOSE:To efficiently produce thin-film magnetic heads in a wafer state by providing a wafer with a groove on the surface to come into contact with gaps and executing this inspection in the wafer state prior to executing slicing. CONSTITUTION:The wafer 21 is provided with the groove 23 on the surface where the media and the head gaps of the thin-film magnetic heads 22 come into contact in the state of forming the plural thin-film magnetic heads 22 on the wafer 21 in the wafer inspecting stage for the thin-film magnetic heads. A chip 24 of a magnetic force microscope (MFM) is inserted into this groove 23. The shapes of the head gap surfaces described above and the electromagnetic conversion characteristics of the thin-film magnetic heads are then inspected.
Abstract:
PURPOSE:To improve reproducing out-put and the prevention of influence due to fluctuation of gap depth. CONSTITUTION:The high magnetic permeable magnetic layer 11 is provided on the part to be stuck of the electrode 5 of the tip part side abuting or facing the opposite surface 4 with or of the magnetic recording medium of the magnetic sensitive part 3 to magnetic reluctance. In this way, by providing the high magnetic permeable magnetic layer, magnetic reluctance to signal magnetic field is reduced.
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a thin film magnetic head by which the thin film magnetic head having high performance and adaptive to higher recording density can be manufactured by enhancing the finishing accuracy at the time of polishing for controlling height. SOLUTION: The manufacturing method for the thin film magnetic head has a stage for forming the pattern of a real element 11 of the thin film magnetic head and the pattern of a resistance element 12 for working in one drawing area 31 of an electron beam drawing device using the electron beam drawing device and a stage for polishing the real element 11 from the sliding surface side of the thin film magnetic head while measuring the resistance value of the resistance element 12 for working.
Abstract:
PROBLEM TO BE SOLVED: To perform a proper operation in a high frequency band by suppressing the reduction of inductance L as much as possible in the high frequency band, and maintaining high head efficiency in the high frequency band. SOLUTION: When a core connecting height equivalent to the length of a part for connection between lower and upper layer cores 14 and 17 is (h), and the core thickness of the thinner film thickness of the lower layer core 14 or the upper layer core 17 is (t), the size of the core connection height (h) is defined so as to set a value (h/t) obtained by standardizing the core connection height (h) by the core thickness (t) in the range of 0.6
Abstract:
PROBLEM TO BE SOLVED: To align a lower pole and an upper pole with high accuracy, to reduce magnetic field leaking from a magnetic gap and to attain efficient recording and reproducing. SOLUTION: The magnetic head is provided with a lower magnetic substance 4, an upper magnetic substance 11 which is disposed to face to the lower magnetic substance 4 and a rear end part (11B) of which is magnetically connected with the lower magnetic substance 4, the lower pole 5 installed on a top end part 4A of the lower magnetic substance 4, a nonmagnetic gap layer 6 installed on the lower pole 5 and the upper pole 7 installed on a top end part 11A of the upper magnetic substance 11. Then, the upper pole 7 is superposed on the lower pole 5 via the nonmagnetic gap layer 6 to be integrally formed. The lower magnetic substance 4 and the upper magnetic substance 11 are disposed to face each other by separating more than five times a gap length and thereby the range of the leakage magnetic field is restrained and magnetic field can be efficiently outputted.
Abstract:
PURPOSE:To greatly improve magnetic characteristics by preventing useless leakage magnetic fields, uniformly and efficiently generating magnetic fields and decreasing Barkhauzen noise, etc., and to make the production process simpler than heretofore. CONSTITUTION:A lower layer shielding magnetic material 2 is formed via an insulating layer 12 on a nonmagnetic substrate 11. A groove is formed on the surface of this lower layer shielding magnetic material 2 and a first layer film 13 which is a nonmagnetic metallic film or insulating film for forming a first reproducing gap is laminated on this groove. A second layer film 14 which is a hard film for biasing for impressing a bias magnetic field to the MR element 1 is laminated on an MR element 1. A lower layer gap insulating layer is thereafter formed on this hard film 14 for biasing and the MR element 1 is formed on this lower layer gap insulating layer. Further, an interlayer insulating layer 16 is formed thereon and an upper layer shielding magnetic material 3 is laminated thereon, by which the MR thin film head is constituted.