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公开(公告)号：DE69711535D1
公开(公告)日：2002-05-08
申请号：DE69711535
申请日：1997-10-13
Applicant: SONY CORP
Inventor： ANDO MAKOTO , ITO YOSHINORI , YAMADA EMI
Abstract: The present invention provides a printer which enables to prevent dispersion of a quantitative medium in a discharge medium during a wait period of time, so as to realize an accurate quantification of the quantitative medium to be mixed with the discharge medium, which enables an accurate gradation expression. The printer includes a printing head having quantitative nozzle communicating with a quantitative medium pressure chamber (53) into which a quantitative medium (45) is introduced and a discharge medium nozzle (66) communicating with a discharge medium pressure chamber (54) into which a discharge medium (49) is introduced. The quantitative medium (45) is made to seep out from the quantitative medium nozzle (64) toward the discharge medium nozzle (66) and after this, the discharge medium is discharged from the discharge medium nozzle to be mixed with the quantitative medium so that the mixture obtained is discharged. The quantitative medium nozzle (64) has an opening of, for example, a crescent shape, i.e., a circular shape with a cut-off portion, and is positioned in such a manner that the nearest point on the opening end of the quantitative medium nozzle from the center of figure of the quantitative medium nozzle faces the discharge medium nozzle which opens adjacently.
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公开(公告)号：DE69711535T2
公开(公告)日：2002-11-28
申请号：DE69711535
申请日：1997-10-13
Applicant: SONY CORP
Inventor： ANDO MAKOTO , ITO YOSHINORI , YAMADA EMI
Abstract: The present invention provides a printer which enables to prevent dispersion of a quantitative medium in a discharge medium during a wait period of time, so as to realize an accurate quantification of the quantitative medium to be mixed with the discharge medium, which enables an accurate gradation expression. The printer includes a printing head having quantitative nozzle communicating with a quantitative medium pressure chamber (53) into which a quantitative medium (45) is introduced and a discharge medium nozzle (66) communicating with a discharge medium pressure chamber (54) into which a discharge medium (49) is introduced. The quantitative medium (45) is made to seep out from the quantitative medium nozzle (64) toward the discharge medium nozzle (66) and after this, the discharge medium is discharged from the discharge medium nozzle to be mixed with the quantitative medium so that the mixture obtained is discharged. The quantitative medium nozzle (64) has an opening of, for example, a crescent shape, i.e., a circular shape with a cut-off portion, and is positioned in such a manner that the nearest point on the opening end of the quantitative medium nozzle from the center of figure of the quantitative medium nozzle faces the discharge medium nozzle which opens adjacently.
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公开(公告)号：JP2001038928A
公开(公告)日：2001-02-13
申请号：JP22046999
申请日：1999-08-03
Applicant: SONY CORP
Inventor： OKAMOTO KENJI , YAMADA EMI , ANDO MASATO
Abstract: PROBLEM TO BE SOLVED: To provide a printing head capable of enhancing the mixing ratio of a fixed quantity medium and an emitting medium and capable of forming a mixed soln. high in concn. for a short time to realize desired max. density. SOLUTION: A printing head has a fixed quantity medium pressure chamber into whcih a fixed quantity medium 45 is introduced, an emitting medium pressure chamber into which an emitting medium 49 is introduced, the fixed quantity medium nozzle 53 connected to the fixed quantity medium pressure chamber and the emitting medium nozzle 54 connected to the emitting medium pressure chamber and arranged so as to be adjacent to the fixed quantity medium nozzle 53 and the fixed quantity medium 45 is allowed to go along the orifice surface of the fixed quantity medium nozzle 53 toward the emitting medium nozzle 54 from the fixed quantity nozzle 53 to be brought into contact with the emitting medium 49 of the emitting medium nozzle 54 to form a mixed soln. and the fixed quantity medium 45 pushed out of the fixed quantity medium nozzle 53 is drawn in the emitting medium nozzle 54 at a time of the emission of the mixed soln. before the mixed soln. is emitted.
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公开(公告)号：JP2000329780A
公开(公告)日：2000-11-30
申请号：JP13926199
申请日：1999-05-19
Applicant: SONY CORP
Inventor： ITO YOSHIKI , YAMADA EMI , TODA AKIRA
Abstract: PROBLEM TO BE SOLVED: To propose a thermal fluid analyzing method capable of more easily analyzing a thermal fluid in a space surrounded with two flat surfaces. SOLUTION: Flow resistance partial differential P/partial differential x which acts on a fluid between two parallel flat surfaces 3A and 3B is defined as an external force X which acts on the fluid, and the two flat surfaces 3A and 3B are defined as slide walls which do not add resistance to the fluid. At the analysis of a thermal fluid between the two flat surfaces 3A and 3B by analyzing the flow of the fluid and heat on the basis of the defined conditions, it is possible to reduce the number of divisions in an analysis area M10 between the two flat surfaces 3A and 3B and to facilitate the analysis of the thermal fluid more by the amount of the reduction.
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公开(公告)号：JPH09193207A
公开(公告)日：1997-07-29
申请号：JP2614396
申请日：1996-01-19
Applicant: SONY CORP
Inventor： ITO YOSHIKI , YAMADA EMI , TAKAHASHI SHINICHIRO , OBINATA KOKICHI , SEGAWA TAKASHI
Abstract: PROBLEM TO BE SOLVED: To accurately transfer the uneven shape of a mold to a molding in a short time. SOLUTION: This mold injects and soidifies a molten material in a space 24 formed by molds 5, 14, 22, 23 to mold a desired molding responsive to the shape of the molds 5, 14, 22, 23. In this case, thermal buffer layers 6, 6a for conducting buffer operation for the temperature change of the surface of the material are provided on the rear surface of the uneven forming part 14 of the molds 5, 14, 22, 23. Thus, when the uneven shape is transferred to the material, the temperature of the part 14 can be sufficiently raised, and the set temperature of the mold 1 is lowered to rapidly lower the temperature of the part 14 after the transfer of the shape is finished.
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Patent Agency Ranking
公开(公告)号：JP2005005892A
公开(公告)日：2005-01-06
申请号：JP2003165519
申请日：2003-06-10
Inventor： SAITO TAKASHI , IMAGAWA TOSHIYUKI , OBA HARUO , YAMADA EMI
IPC: G06F1/16 , H01Q1/24 , H04B1/38 , H04B1/3822 , H04M1/02
Abstract: PROBLEM TO BE SOLVED: To provide a portable information terminal unit which is restrained from deteriorating its antenna radiation efficiency even in use while keeping a small size and light weight. SOLUTION: The portable information terminal device is composed of a device body 2 equipped with a radio communication module 9 and a display unit 6, an antenna unit 3 which contains a built-in antenna element 18 and is formed separately from the device body 2, and a cable unit 4 which is connected to the antenna 3 so as to be separated from the device body 2 at a prescribed distance, and connects a radio communication module 9 and the antenna element 18 together with a signal transmission line 19. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供一种便携式信息终端单元，其在保持小尺寸和轻量的同时即使在使用中也被抑制其天线辐射效率的恶化。 解决方案：便携式信息终端设备由装备有无线通信模块9和显示单元6的设备主体2，天线单元3组成，天线单元3包含内置天线元件18，并与设备分开形成 主体2和电缆单元4，其连接到天线3以便以规定距离与设备主体2分离，并且将无线电通信模块9和天线元件18与信号传输线路19连接在一起。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JPH11291292A
公开(公告)日：1999-10-26
申请号：JP9319798
申请日：1998-04-06
Applicant: SONY CORP
Inventor： SEGAWA TAKASHI , TAKAHASHI SHINICHIRO , KUWABARA TOMOJI , ITO YOSHIKI , YAMADA EMI
Abstract: PROBLEM TO BE SOLVED: To improve reliability of product quality by forming a heat insulating layer laminated on a mounting face of a matrix with given recessed and projected pattern out of peripheral wall faces, and a wear-resistant layer laminated on the heat insulating layer. SOLUTION: A heat buffer layer 6 formed of ceramic of low heat conductivity is formed on a mirror surface 5A of a fixed side mirror 5. A wear-resistant layer 7 formed of a metal of superior wear resistance and conductivity slightly better than that of the heat buffer layer is formed on one surface 6A of the fixed side mirror. The thickness of a section forming the total of the fixed side mirror 5, the heat buffer layer 6 and the wear-resistant layer 7 is formed slightly thinner than the thickness of a fixed side template 4. Also the length of a first insert die 8 is of the constitution in which its end face 8A is positioned on the same plane as one face 7A of the wear-resistant layer 7. A stamper 13 forming the recessed and projected shape to be transferred onto a molded product is inserted into recessed sections on a starting section of the inner peripheral face of the fixed side template 4 of a fixed side mold 2 and a starting section of one face 7A of the wear-resistant layer 7 and the outer peripheral face of a second insert die 9.
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公开(公告)号：JP2002001204A
公开(公告)日：2002-01-08
申请号：JP2000186813
申请日：2000-06-21
Applicant: SONY CORP
Inventor： ITO YOSHIKI , YAMADA EMI , TODA AKIRA
Abstract: PROBLEM TO BE SOLVED: To provide a spin coating method which can form a uniform resist film while a resist liquid is saved. SOLUTION: In the spin coating method in which a resist 17 is supplied onto a substrate 13 rotated by a rotary shaft 12 to form a resist film, in a process from the start of the supply of the resist 17 to the end of the supply, by controlling the supply of the resist 17 to increase the supply with the passage of time corresponding to the area of the resist 17 spread on the substrate 13, the shortage of the resist 17 in the circumferential fringe part of the substrate 13 is solved to prevent the nonuniformity of application and to save the resist 17 liquid.
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公开(公告)号：JP2001144066A
公开(公告)日：2001-05-25
申请号：JP32768999
申请日：1999-11-18
Applicant: SONY CORP
Inventor： ITO YOSHIKI , YAMADA EMI
IPC: B08B3/04 , H01L21/304
Abstract: PROBLEM TO BE SOLVED: To obtain a spin processing apparatus capable of reducing the possibility that a jetted processing solution scatters in the form of mist due to the rotation of a semiconductor wafer and especially deposits onto the underside of the semiconductor wafer. SOLUTION: This spin processing apparatus IA causes a rotation driving unit 3 fixed to a base 2 to rotate a semiconductor wafer S at a predetermined rpm while holding the wafer S in a horizontal position, and cleans the surface of the wafer S while jetting a rinsing solution L from a nozzle 6. The apparatus 1A has a cup 7 for covering its substantially entire peripheral portion including the periphery of the wafer S in order to prevent the scattering of the jetted solution L. In this apparatus 1A, a cylindrical wall 9 is provided such that the wall 9 covers the unit 3, its upper end is located directly under the vicinity of the periphery of the wafer S, and its lower end comes in contact with the base 2. Further, exhaust ports 8 and 10 are provided which communicate with an outside region and an inside region of the wall 9, respectively, to produce downflowing currents. Thus, upon sucking and exhausting the downflowing air from the port 8 in the outside region of the wall 9, air containing mist is sucked and exhausted from the port 10 in the inside region of the wall 9.
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公开(公告)号：JP2001129501A
公开(公告)日：2001-05-15
申请号：JP31706099
申请日：1999-11-08
Applicant: SONY CORP
Inventor： ITO YOSHIKI , YAMADA EMI , TODA AKIRA , WATANABE YOSHIO
Abstract: PROBLEM TO BE SOLVED: To provide a washing apparatus capable of sufficiently washing not only a substrate having a through small hole but also the substrate having a non-through small hole. SOLUTION: The washing apparatus 10 is equipped with a washing tank 12 containing a treating liquid, a carrying belt 14 traveling in the treating liquid, a jetting nozzle 16 jetting the treating liquid toward the carrying belt, and baffle plates 18 spaced apart from one another. A printed wiring substrate B having an opening of the non-through hole directed upward is loaded on the carrying belt, and the belt travels in the treating liquid. By jetting the treating liquid toward the carrying belt by the jetting nozzle, the treating liquid forms a liquid flow along the carrying belt. The liquid flow flowing along the carrying belt collides against the baffle plate, a part of the liquid flow changes its direction, and enteres a small non-through hole at an oblique downward flow. The liquid flow becomes easy to enter the interior of the non-through hole of the substrate B, the treating liquid is circulated in the whole area inside the non-through hole, its replacement becomes perfect, and therefore washing of the non-through hole becomes perfect and sure.
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