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公开(公告)号:JP2010022000A
公开(公告)日:2010-01-28
申请号:JP2009161062
申请日:2009-07-07
Applicant: Commissariat A L'energie Atomique , St Microelectronics Sa , エス テ マイクロエレクトロニクス エス アー , コミサリア ア エナジー アトミック
Inventor: DURAND CEDRIC , CASSET FABRICE
CPC classification number: H03H9/02448 , H03H3/0076 , H03H9/2436 , H03H9/2463 , H03H2009/0237 , H03H2009/02496 , H03H2009/2442
Abstract: PROBLEM TO BE SOLVED: To provide a resonator that overcomes a marked drop in its frequency during a rise in temperature, and to provide a method of forming the resonator. SOLUTION: The resonator is a bulk-mode resonator including a resonant element 20 that includes a bulk 21 and a columnar portion 24. The columnar portion 24 is formed of a Young's modulus material having a temperature coefficient sign of the bulk material and a temperature coefficient of an opposite sign. Furthermore, the columnar portion 24 is dispersed such that it is vertically long with respect to the vibration direction of a bulk wave, and intercepts the resonant element 20 in the expansion/compression direction of the resonant element 20 to have a continuous part of the bulk 21. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题:提供一种谐振器,其在温度升高期间克服其频率的显着下降,并提供形成谐振器的方法。 解决方案:谐振器是包括谐振元件20的体模式谐振器,谐振元件20包括主体21和柱状部分24.柱状部分24由具有散装材料的温度系数符号的杨氏模量材料形成, 相反符号的温度系数。 此外,柱状部分24相对于体波的振动方向被分散成垂直长度,并且在共振元件20的膨胀/压缩方向上截获谐振元件20以具有连续部分的体积 21.版权所有(C)2010,JPO&INPIT
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公开(公告)号:FR2921916B1
公开(公告)日:2011-04-29
申请号:FR0758173
申请日:2007-10-09
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , ST MICROELECTRONICS SA
Inventor: CASSET FABRICE , DURAND CEDRIC
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公开(公告)号:FR2906238B1
公开(公告)日:2008-12-19
申请号:FR0653975
申请日:2006-09-27
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , ST MICROELECTRONICS SA
Inventor: CASSET FABRICE , DURAND CEDRIC , ANCEY PASCAL
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公开(公告)号:FR2973608A1
公开(公告)日:2012-10-05
申请号:FR1152729
申请日:2011-03-31
Applicant: ST MICROELECTRONICS SA , UNIV GRENOBLE 1
Inventor: CIVET YOAN , CASSET FABRICE , BASROUR SKANDAR , CARPENTIER JEAN-FRANCOIS
Abstract: L'invention concerne un procédé d'ajustement de la fréquence de résonance d'un élément vibrant, comprenant des étapes de mesure de la fréquence de résonance de l'élément vibrant (11), de détermination à l'aide d'abaques et en fonction de la fréquence de résonance mesurée, des dimensions et une position d'au moins une zone d'épaisseur modifiée à former sur l'élément vibrant pour que la fréquence de résonance de celui-ci corresponde à une fréquence de consigne, et former sur l'élément vibrant, une zone d'épaisseur modifiée aux dimensions et position déterminées.
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公开(公告)号:DE602005001245D1
公开(公告)日:2007-07-12
申请号:DE602005001245
申请日:2005-09-15
Applicant: ST MICROELECTRONICS SA , COMMISSARIAT ENERGIE ATOMIQUE
Inventor: ANCEY PASCAL , ABELE NICOLAS , CASSET FABRICE
Abstract: A MOS transistor with a deformable gate formed in a semiconductor substrate (10), comprises : (A) some source and drain zones (11, 12) separated by a channel zone (13) extending in a first direction from the source to the drain and in a second direction perpendicular to the first direction; (B) a conducting gate beam (16) placed at least above the channel zone extending in the second direction between some support points placed on the substrate at each side of the channel zone. The surface of the channel zone is hollow and has a form similar to that of the gate beam when it is in maximum deflection towards the channel zone. Independent claims are also included for : (A) a circuit oscillator incorporating this transistor; (B) the fabrication of this transistor with a deformable gate.
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公开(公告)号:FR2881416B1
公开(公告)日:2007-06-01
申请号:FR0550276
申请日:2005-01-31
Inventor: ABELE NICOLAS , ANCEY PASCAL , TALBOT ALEXANDRE , SEGUENI KARIM , BOUCHE GUILLAUME , SKOTNICKI THOMAS , MONFRAY STEPHANE , CASSET FABRICE
Abstract: The microresonator has a resonant unit (160) made from monocrystalline silicon, and activation electrodes (120, 121) positioned close to the resonant unit. The unit (160) is placed in an opening in a semiconductor layer (110) that covers a substrate (100). The electrodes (120, 121) are formed in the layer and leveled with the opening. The unit (160) is in the shape of mushroom whose leg is fixed on the substrate. An independent claim is also included for a method of fabricating a microresonator.
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公开(公告)号:FR2881416A1
公开(公告)日:2006-08-04
申请号:FR0550276
申请日:2005-01-31
Inventor: ABELE NICOLAS , ANCEY PASCAL , TALBOT ALEXANDRE , SEGUENI KARIM , BOUCHE GUILLAUME , SKOTNICKI THOMAS , MONFRAY STEPHANE , CASSET FABRICE
Abstract: L'invention concerne un microrésonateur comprenant un élément résonant (160) en silicium monocristallin et au moins une électrode d'activation (120, 121) placée à proximité de l'élément résonant, dans lequel l'élément résonant est placé dans une ouverture d'une couche semiconductrice (110) recouvrant un substrat (100), l'électrode d'activation étant formée dans la couche semiconductrice et affleurant au niveau de l'ouverture.
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公开(公告)号:FR2862806A1
公开(公告)日:2005-05-27
申请号:FR0350911
申请日:2003-11-25
Applicant: ST MICROELECTRONICS SA , COMMISSARIAT ENERGIE ATOMIQUE
Inventor: BOUCHE GUILLAUME , RIVOIRE MAURICE , CASSET FABRICE
Abstract: The capacitor has a conducting layer (15) covering the interior of a grooved portion, and a flexible conducting membrane (16) placed above the portion, a dielectric layer (17) providing isolation between the two. The depth of the groove portion increases continuously from the lateral edges to the center, and the conducting layer covers one edge. Application of a voltage causes a progressive and proportional deformation of the flexible conducting membrane towards the conducting layer, producing a variable capacitance. Independent claims are also included for the following: (A) a resonator having a capacitor according to the invention; (B) a switch having a capacitor according to the invention; and (C) a method of forming a variable capacitor.
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公开(公告)号:FR2964789A1
公开(公告)日:2012-03-16
申请号:FR1003633
申请日:2010-09-10
Inventor: CASSET FABRICE , CADIX LIONEL , COUDRAIN PERCEVAL , FARCY ALEXIS , CHAPELON LAURENT LUC , FELK YACINE , ANCEY PASCAL
IPC: H01L23/495 , H01L21/027 , H01L21/441
Abstract: Le circuit intégré comporte un substrat de support (1) ayant des première et seconde faces principales (2a, 2b) opposées. Une cavité traverse le substrat de support (1) et relie les première et seconde faces principales (2a, 2b). Le circuit intégré comporte un dispositif à élément mobile (5) dont l'élément mobile (6) et un couple d'électrodes (7) associées sont inclus dans une cavité. Un nœud d'ancrage de l'élément mobile (6) est localisé au niveau de la première face principale (2a). Le circuit intégré comprend une première puce (3) élémentaire disposée au niveau de la première face principale (2a) et connectée électriquement au dispositif à élément mobile (5).
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公开(公告)号:AT499745T
公开(公告)日:2011-03-15
申请号:AT08805144
申请日:2008-10-08
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , ST MICROELECTRONICS SA
Inventor: CASSET FABRICE , DURAND CEDRIC
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