公开(公告)号：WO2006120309A2

公开(公告)日：2006-11-16

申请号：PCT/FR2006000669

申请日：2006-03-29

Applicant: ST MICROELECTRONICS SA ,  PALMADE ROMAIN ,  ROGGE AGNES

Inventor： PALMADE ROMAIN ,  ROGGE AGNES

CPC classification number: H01L24/75 ,  H01L23/13 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/05 ,  H01L2224/24227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00014

Abstract: The invention relates to a semiconductor chip comprising an active face provided with an integrated circuit area which is implemented thereon and comprises at least one lateral inclined contact pad extending below the active face plane and electrically connected to the integrated circuit area. The invention also relates to an electronic module comprising a substrate provided with a cavity in which the chip is arranged. Said invention is used, in particular, for producing low-thickness contact-less micromodules for chip cards, badges and contact-less electronic labels.

Abstract translation: 本发明涉及一种半导体芯片，其包括设置有集成电路区域的有源面，其实现在其上，并且包括在有源面平面下方延伸并电连接到集成电路区域的至少一个侧向倾斜接触焊盘。 本发明还涉及一种电子模块，其包括设置有芯片的空腔的基板。 特别地，本发明用于生产用于芯片卡，徽章和无接触电子标签的低厚度无接触微型模块。

公开(公告)号：FR2893734A1

公开(公告)日：2007-05-25

申请号：FR0511750

申请日：2005-11-21

Applicant: ST MICROELECTRONICS SA

Inventor： ROGGE AGNES

IPC: G06K19/077 ,  H01L21/60 ,  H01L25/00

Abstract: L'invention concerne un procédé de fabrication d'un micromodule comprenant un circuit intégré (3) et une bobine d'antenne connectée électriquement au circuit intégré. Selon l'invention, le procédé comprend des étapes consistant à réaliser le circuit intégré (3) et des plages de contact (4A, 4B) du circuit intégré sur une première plaquette (1) de matériau semi-conducteur, réaliser un enroulement conducteur (13) formant bobine et des plages de contact (18A, 18B) de la bobine sur une seconde plaquette (10) de matériau semi-conducteur, et assembler la première et la seconde plaquettes l'une contre l'autre tout en mettant les plages de contact de la bobine en contact avec des plages de contact du circuit intégré.

公开(公告)号：DE602006006136D1

公开(公告)日：2009-05-20

申请号：DE602006006136

申请日：2006-11-07

Applicant: ST MICROELECTRONICS SA

Inventor： ROGGE AGNES

IPC: G06K19/077 ,  H01L23/48

Abstract: The production of an electronic micromodule having an integrated circuit and an antenna coil electrically connected to the circuit, comprises making an integrated circuit and cylindrical contact pad of the circuit on a semiconductor plate material, making a coil winding conductor and the contact pad of the coil on the another plate, assembling the plates one against the other while contacting the coil pad with the integrated circuit pad, and forming an openings that crosses the first and second face of the second plate on which the winding conductor is formed. The production of an electronic micromodule having an integrated circuit and an antenna coil electrically connected to the integrated circuit, comprises making an integrated circuit and cylindrical contact pad of the circuit on a semiconductor plate material, making a coil winding conductor and the contact pad of the coil on the another plate, assembling the plates one against the other while contacting the coil pad with the integrated circuit pad, forming an openings crossing the first and second face of the second plate on which the winding conductor is formed, filling the openings with a conductor material to obtain an electrical conductor that connects the winding conductor at the contact pad of the coil, forming a groove on the second plate in the form of coil, filling the groove with an electrical conductor material to obtain the coil winding conductor, forming the pads (6A, 6B) in an electrical conductor material on the contact pad of the coil and the integrated circuit so that the electrical contact between the coil and the integrated circuit is established by the pads followed by the assembly of the plates, treating the pads by fusing, bonding or joining, and depositing a polymeric material on the first/second plate (10) to assemble the plates. The integrated circuit and the contact pad of the circuit are formed on the first face of the first plate (1). The conductor coil is formed on the first face of the second plate. The formation of the opening comprises forming blind holes on the first face of the second plate, and thinning the second plate so that the blind holes open to the second face of the second plate. The pads are made up of a material comprising metals, composition of metals, eutectic alloy and non-eutectic hard alloy. Independent claims are included for the following: (1) the production of collective micromodules; and (2) a micromodule.