公开(公告)号：WO2006120309A2

公开(公告)日：2006-11-16

申请号：PCT/FR2006000669

申请日：2006-03-29

Applicant: ST MICROELECTRONICS SA ,  PALMADE ROMAIN ,  ROGGE AGNES

Inventor： PALMADE ROMAIN ,  ROGGE AGNES

CPC classification number: H01L24/75 ,  H01L23/13 ,  H01L23/49855 ,  H01L24/05 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/05 ,  H01L2224/24227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00014

Abstract: The invention relates to a semiconductor chip comprising an active face provided with an integrated circuit area which is implemented thereon and comprises at least one lateral inclined contact pad extending below the active face plane and electrically connected to the integrated circuit area. The invention also relates to an electronic module comprising a substrate provided with a cavity in which the chip is arranged. Said invention is used, in particular, for producing low-thickness contact-less micromodules for chip cards, badges and contact-less electronic labels.

Abstract translation: 本发明涉及一种半导体芯片，其包括设置有集成电路区域的有源面，其实现在其上，并且包括在有源面平面下方延伸并电连接到集成电路区域的至少一个侧向倾斜接触焊盘。 本发明还涉及一种电子模块，其包括设置有芯片的空腔的基板。 特别地，本发明用于生产用于芯片卡，徽章和无接触电子标签的低厚度无接触微型模块。

公开(公告)号：WO2008141232A3

公开(公告)日：2009-02-19

申请号：PCT/US2008063311

申请日：2008-05-09

Applicant: ATMEL CORP ,  PARLANGE DOMINIQUE ,  ENGUENT JEAN PIERRE ,  PALMADE ROMAIN

Inventor： PARLANGE DOMINIQUE ,  ENGUENT JEAN PIERRE ,  PALMADE ROMAIN

IPC: H04B1/16 ,  G06K7/00 ,  G06K19/07

CPC classification number: G06K19/0723 ,  G06K19/0701 ,  G06K19/0775

Abstract: In some implementations, a mobile device includes a first interface configured to communicably couple to a removable integrated circuit card; a second interface configured to wirelessly communicate with a contactless reader that is external to the mobile device; a communication interface that couples the first interface and the second interface and that is configured to obtain information from an integrated circuit card that is coupled to the first interface in response to receipt by the second interface of an information request from the contactless reader, and a programmable timer that is configured to be started in response to the second interface receiving an information request from the contactless reader, and that is further configured to, upon reaching a programmed value, cause the second interface to transmit the obtained information to the contactless reader. In another implementation, a power storage is configured to store power received by the second interface and provider stored power to the first interface, the second interface and the communication interface.

Abstract translation: 在一些实施方案中，移动设备包括配置成可通信地耦合到可移除集成电路卡的第一接口; 第二接口，被配置为与所述移动设备外部的非接触式读取器无线通信; 通信接口，其耦合所述第一接口和所述第二接口，并且被配置为响应于所述第二接口接收到来自所述非接触式读取器的信息请求而从耦合到所述第一接口的集成电路卡获取信息，以及 可编程定时器，其被配置为响应于所述第二接口从所述非接触式读取器接收到信息请求而启动，并且还被配置为在达到编程值时使所述第二接口将所获得的信息发送到所述非接触读取器。 在另一实现中，功率存储器被配置为将由第二接口接收的功率和提供商存储的功率存储到第一接口，第二接口和通信接口。

公开(公告)号：DE60204124D1

公开(公告)日：2005-06-16

申请号：DE60204124

申请日：2002-02-14

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07

公开(公告)号：FR2822272B1

公开(公告)日：2003-06-27

申请号：FR0103401

申请日：2001-03-13

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07 ,  G06K7/00

公开(公告)号：FR2822272A1

公开(公告)日：2002-09-20

申请号：FR0103401

申请日：2001-03-13

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07 ,  G06K7/00

Abstract: The invention relates to a contactless electronic chip card (10) characterised in that it comprises: a device for communicating (14) with a contactless electronic chip card reader (12) that communicates according to ISO standard 14443-4; a contact electronic chip card-type operating system (16) communicating by APDU command and APDU response according to ISO standard 7816-4; and a protocol conversion interface (18) between the communication device (14) and the operating system (16).

公开(公告)号：DE60204124T2

公开(公告)日：2006-01-19

申请号：DE60204124

申请日：2002-02-14

Applicant: ST MICROELECTRONICS SA

Inventor： PALMADE ROMAIN

IPC: G06K7/10 ,  G06K19/07