INTEGRATION OF MOS DEVICE AND SEMICONDUCTOR CHIP

    公开(公告)号:JPH11214529A

    公开(公告)日:1999-08-06

    申请号:JP30387798

    申请日:1998-10-26

    Abstract: PROBLEM TO BE SOLVED: To make it possible to integrate a plurality of MOS devices of different voltage thresholds in one and the same substrate, by a method wherein when forming a plurality of channel regions for the MOS devices, impurities are selectively doped into a geometrical pattern with a gate electrode as a mask. SOLUTION: After a gate oxide film 3 and a polycrystalline silicon layer 4 are formed, these layers 3, 4 are selectively removed to form square openings for a transistor 1' and stripe openings for a transistor 1" to form a gate electrode 5, 5' for the transistor 1', 1". Then, with the gate electrode 5, 5' as a mask, P-type impurities are selectively doped into a drain layer 2 to form the main body region 7 of the transistor 1', 1". The main body region 7 has a square or stripe shape and is extended under the gate electrode 5, 5' to form a channel region of the transistor. Again, N-type impurities are selectively doped into the main body region 7 with the gate electrode 5, 5' as a mask to form a source region.

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