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公开(公告)号：IT201700074269A1
公开(公告)日：2019-01-03
申请号：IT201700074269
申请日：2017-07-03
Inventor： COLOMBO ROBERTO , BERTONI GUIDO MARCO , ORLANDO WILLIAM , VITTIMANI ROBERTA
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公开(公告)号：IT201700050166A1
公开(公告)日：2018-11-09
申请号：IT201700050166
申请日：2017-05-09
Inventor： COLOMBO ROBERTO , GROSSIER NICOLAS BERNARD , VITTIMANI ROBERTO
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公开(公告)号：IT201700050086A1
公开(公告)日：2018-11-09
申请号：IT201700050086
申请日：2017-05-09
Inventor： COLOMBO ROBERTO , GROSSIER NICOLAS BERNARD , DI SIRIO GIOVANNI , RE FIORENTIN LORENZO
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公开(公告)号：ITMI20020931A1
公开(公告)日：2003-11-03
申请号：ITMI20020931
申请日：2002-05-02
Applicant: ST MICROELECTRONICS SRL
Inventor： ALBA SIMONE , COLOMBO ROBERTO , CIOVACCO FRANCESCO , SAVARDI CHIARA
IPC: H01L21/027 , H01L21/033 , H01L21/308 , H01L21/311 , H01L21/3213 , H01L21/768 , H01L21/8234
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公开(公告)号：IT201700074295A1
公开(公告)日：2019-01-03
申请号：IT201700074295
申请日：2017-07-03
Inventor： COLOMBO ROBERTO , BERTONI GUIDO MARCO , ORLANDO WILLIAM , VITTIMANI ROBERTA
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Patent Agency Ranking6.发明专利
公开(公告)号：IT201700050153A1
公开(公告)日：2018-11-09
申请号：IT201700050153
申请日：2017-05-09
Inventor： COLOMBO ROBERTO , GROSSIER NICOLAS BERNARD , DI SIRIO GIOVANNI
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公开(公告)号：ITTO20080667A1
公开(公告)日：2010-03-11
申请号：ITTO20080667
申请日：2008-09-10
Applicant: ST MICROELECTRONICS SRL
Inventor： BRATTICO LUCILLA , CASELLATO CRISTINA , COLOMBO ROBERTO , MAGISTRETTI MICHELE , PELLIZZER FABIO
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公开(公告)号：DE60218643D1
公开(公告)日：2007-04-19
申请号：DE60218643
申请日：2002-06-28
Applicant: ST MICROELECTRONICS SRL
Inventor： CIOVACCO FRANCESCO , SAVARDI CHIARA , COLOMBO ROBERTO
IPC: H01L21/762 , H01L21/3065 , H01L21/308
Abstract: A process for forming trenches with an oblique profile and rounded top corners, including the steps of: in a semiconductor wafer (20), through a first polymerizing etch, forming depressions (28) delimited by rounded top corners (29); and through a second polymerizing etch, opening trenches (31) at the depressions (29). The second polymerizing etch is made in variable plasma conditions, so that the trenches (31) have oblique walls (37) with a constant slope ( alpha ).
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公开(公告)号：ITMI20031591A1
公开(公告)日：2005-02-02
申请号：ITMI20031591
申请日：2003-08-01
Applicant: ST MICROELECTRONICS SRL
Inventor： CIOVACCO FRANCESCO , COLOMBO ROBERTO
IPC: H01L21/3065 , H01L21/308 , H01L31/109 , H05K20060101
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公开(公告)号：ITMI20020931D0
公开(公告)日：2002-05-02
申请号：ITMI20020931
申请日：2002-05-02
Applicant: ST MICROELECTRONICS SRL
Inventor： ALBA SIMONE , COLOMBO ROBERTO , CIOVACCO FRANCESCO , SAVARDI CHIARA
IPC: H01L21/027 , H01L21/033 , H01L21/308 , H01L21/311 , H01L21/3213 , H01L21/768 , H01L21/8234
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