公开(公告)号：JPH115820A

公开(公告)日：1999-01-12

申请号：JP11872498

申请日：1998-04-28

Applicant: ST MICROELECTRONICS SRL

Inventor： CEROFOLINI GIANFRANCO ,  DE SANTI GIORGIO ,  CRISENZA GIUSEPPE

IPC: C01B33/12 ,  C08F292/00 ,  C08L51/10 ,  H01B3/30 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: PROBLEM TO BE SOLVED: To obtain a dielectric film suitable for use between laminated conductive layers in integrated circuit and provide a method for producing the dielectric film. SOLUTION: A laminated insulating film between laminated conductive layers constituting mutual connection of integrated circuit is constituted by grafting an organic monomer onto an aerogel comprising an inorganic oxide by impulse of an inactive ion and then integrating the organic monomer into the aerogel in order to partially pack many pores of the inorganic aerogel. A composite dielectric substance has a satisfactory thermal budget which is thermally stable. This method for producing the aerogel film comprises spinning a precursor compound solution on a wafer and then, carrying out supercritical solvent extraction in a spinning chamber.

公开(公告)号：DE69705387D1

公开(公告)日：2001-08-02

申请号：DE69705387

申请日：1997-04-28

Applicant: ST MICROELECTRONICS SRL

Inventor： CEROFOLINI GIANFRANCO ,  DE SANTI GIORGIO ,  CRISENZA GIUSEPPE

IPC: C01B33/12 ,  C08F292/00 ,  C08L51/10 ,  H01B3/30 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: An insulating film between stacked electrically conducting layers through which interconnections of integrated circuits are realized, is composed of an aerogel of an inorganic oxide on which organic monomers have been grafted under inert ion bombardment and successively further incorporated in the aerogel to fill at least partially the porosities of the inorganic aerogel. The composite dielectric material is thermally stable and has a satisfactory thermal budget. The method of forming an aerogel film includes the spinning of a precursor compound solution onto the wafer followed by supercritical solvent extraction carried out in the spinning chamber.

公开(公告)号：DE69321106T2

公开(公告)日：1999-02-25

申请号：DE69321106

申请日：1993-06-28

Applicant: ST MICROELECTRONICS SRL

Inventor： CAPRILE CANDIDA ,  DE SANTI GIORGIO

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/485 ,  H01L23/522 ,  H01L21/60 ,  H01L23/60

公开(公告)号：DE69321106D1

公开(公告)日：1998-10-22

申请号：DE69321106

申请日：1993-06-28

Applicant: ST MICROELECTRONICS SRL

Inventor： CAPRILE CANDIDA ,  DE SANTI GIORGIO

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/485 ,  H01L23/522 ,  H01L21/60 ,  H01L23/60

公开(公告)号：DE69705387T2

公开(公告)日：2001-10-11

申请号：DE69705387

申请日：1997-04-28

Applicant: ST MICROELECTRONICS SRL

Inventor： CEROFOLINI GIANFRANCO ,  DE SANTI GIORGIO ,  CRISENZA GIUSEPPE

IPC: C01B33/12 ,  C08F292/00 ,  C08L51/10 ,  H01B3/30 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: An insulating film between stacked electrically conducting layers through which interconnections of integrated circuits are realized, is composed of an aerogel of an inorganic oxide on which organic monomers have been grafted under inert ion bombardment and successively further incorporated in the aerogel to fill at least partially the porosities of the inorganic aerogel. The composite dielectric material is thermally stable and has a satisfactory thermal budget. The method of forming an aerogel film includes the spinning of a precursor compound solution onto the wafer followed by supercritical solvent extraction carried out in the spinning chamber.

公开(公告)号：DE60220245D1

公开(公告)日：2007-07-05

申请号：DE60220245

申请日：2002-01-17

Applicant: ST MICROELECTRONICS SRL ,  OVONYX INC

Inventor： ZONCA ROMINA ,  MARANGON MARIA SANTINA ,  DE SANTI GIORGIO

IPC: H01L45/00