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5 records (took 0.023 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE602004011195T2

    公开(公告)日：2009-01-08

    申请号：DE602004011195

    申请日：2004-05-31

    Applicant: ST MICROELECTRONICS SRL

    Inventor： FERRARA MAURIZIO MARIA ,  MAGRI ANGELO ,  MINOTTI AGATINO

    IPC: H01L23/31 ,  H01L23/495 ,  H01L23/52

    Abstract: A vertical conduction power electronic device package (1) and corresponding assembly method comprising at least a metal frame (2) suitable to house at least a plate or first semiconductor die (16,35) having at least a first (17) and a second conduction terminal (18) on respective opposed sides of the first die (16,35). The first conduction terminal (17) being in contact with said metal frame (2) and comprising at least an intermediate frame (23,24) arranged in contact with said second conduction terminal (18).

    3.
    发明专利
    未知

    公开(公告)号：DE602004011195D1

    公开(公告)日：2008-02-21

    申请号：DE602004011195

    申请日：2004-05-31

    Applicant: ST MICROELECTRONICS SRL

    Inventor： FERRARA MAURIZIO MARIA ,  MAGRI ANGELO ,  MINOTTI AGATINO

    IPC: H01L23/31 ,  H01L23/495 ,  H01L23/52

    Abstract: A vertical conduction power electronic device package (1) and corresponding assembly method comprising at least a metal frame (2) suitable to house at least a plate or first semiconductor die (16,35) having at least a first (17) and a second conduction terminal (18) on respective opposed sides of the first die (16,35). The first conduction terminal (17) being in contact with said metal frame (2) and comprising at least an intermediate frame (23,24) arranged in contact with said second conduction terminal (18).

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