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    DEVIATED END MOLD FOR PLASTIC PACKAGE OF INTEGRATED SEMICONDUCTOR DEVICE
    1.
    发明专利
    DEVIATED END MOLD FOR PLASTIC PACKAGE OF INTEGRATED SEMICONDUCTOR DEVICE 失效

    公开(公告)号：JP2001047473A

    公开(公告)日：2001-02-20

    申请号：JP2000236792

    申请日：2000-08-04

    Applicant: ST MICROELECTRONICS SRL

    Inventor： POINELLI RENATO ,  MAZZOLA MAURO ,  BRIOSCHI ROBERTO

    IPC: B29C45/26 ,  B29C45/14 ,  H01L21/56

    Abstract: PROBLEM TO BE SOLVED: To completely fill a resin in a cavity and to prevent a flash at a molding by deviating an inside end of an upper side half mold for forming a mold to an inside with respect to an inside end of a lower side half mold, and cooperating a spoiler of a lead frame to limit an opening dimension of a slit. SOLUTION: A semiconductor die 1 is assembled on a depressed central pad 2 of a lead frame 3 made of a metal, and sealed in a cavity 6 formed of both upper and lower half molds 4 and 5. Then, a slit 7 is formed at adjacent parts to the pad 2 and the frame 3, and a resin is charged in the cavity 6 from the slit 7. That is, one end 8 of the pad 2 is bent upward to form a deflecting plate and a spoiler, and the slit 7 is formed. An inside end of the mold 4 is deviated to the inside with respect to the inside end of the mold 5, and when the molds 4, 5 are connected, a size of the slit 7 is reduced. Thus, the resin can be completely charge din the cavity 6.

    3.
    发明专利
    未知

    公开(公告)号：DE69620564D1

    公开(公告)日：2002-05-16

    申请号：DE69620564

    申请日：1996-01-25

    Applicant: ST MICROELECTRONICS SRL

    Inventor： POINELLI RENATO ,  MAZZOLA MAURO

    IPC: H01L23/50 ,  H01L21/673 ,  H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34

    Abstract: A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate (2) that is arranged on the bottom of the plastic package and has thinner ends (2'); its particularity is that the length (LH) of the heat sink plate is at least equal to the minimum length (Lp) of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

    4.
    发明专利
    未知

    公开(公告)号：DE69620564T2

    公开(公告)日：2003-01-30

    申请号：DE69620564

    申请日：1996-01-25

    Applicant: ST MICROELECTRONICS SRL

    Inventor： POINELLI RENATO ,  MAZZOLA MAURO

    IPC: H01L23/50 ,  H01L21/673 ,  H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34

    Abstract: A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate (2) that is arranged on the bottom of the plastic package and has thinner ends (2'); its particularity is that the length (LH) of the heat sink plate is at least equal to the minimum length (Lp) of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

    5.
    发明专利
    未知

    公开(公告)号：DE69636853T2

    公开(公告)日：2007-11-08

    申请号：DE69636853

    申请日：1996-11-27

    Applicant: ST MICROELECTRONICS SRL

    Inventor： FERRI STEFANO ,  ROSSI ROBERTO ,  POINELLI RENATO

    IPC: B29C45/26 ,  H01L21/56 ,  B29C45/14 ,  B29L31/34 ,  H01L23/433

    Abstract: A method for forming a plastic package (35) for a power semiconductor electronic device to be encapsulated within a plastic case (2) and to be coupled thermally to a heat sink element (25) having a major surface (27) exposed and at least one peripheral portion (36) extending outwards from at least one side of the plastic case (2), of the type wherein it provides for forming the plastic case (2) of the package by molding inside a main cavity (24) of a mold (23) after positioning the heat sink element (25) with this major surface (27) in contact with the bottom of a suitable housing (26) provided in a lower portion of the mold (23) which opens into the main cavity (24) of the mold. According to the invention, the following steps are provided: forming the heat sink element (25) such that at least side surfaces (29) jutting out of said side of the plastic case (2) are, at least in a zone adjacent to that side and in the peripheral portion (36), inclined to form an angle ( alpha ) substantially greater than zero with a normal line (N) to the major surface (27), so as to have a negative slope from outside; correspondingly forming the housing (26) such that its inner walls (28) facing said side surfaces (29) of the heat sink element are inclined, at least in that zone, to form an angle substantially equal to the angle ( alpha ) with the normal line (N), with a positive slope from the housing interior; and providing thrust means (30) which, when the mold (23) is closed, are engaged from above with at least part of the peripheral portion (36) of the heat sink element (25) to exert thereon a compressive force substantially toward the housing (26) bottom and which is effective to hermetically seal temporarily the side surfaces (29) of the heat sink element and the inner walls (28) of the housing in the zone adjacent to said side of the plastic case.

    8.
    发明专利
    未知

    公开(公告)号：DE69636853D1

    公开(公告)日：2007-03-08

    申请号：DE69636853

    申请日：1996-11-27

    Applicant: ST MICROELECTRONICS SRL

    Inventor： FERRI STEFANO ,  ROSSI ROBERTO ,  POINELLI RENATO

    IPC: B29C45/26 ,  H01L21/56 ,  B29C45/14 ,  B29L31/34 ,  H01L23/433

    Abstract: A method for forming a plastic package (35) for a power semiconductor electronic device to be encapsulated within a plastic case (2) and to be coupled thermally to a heat sink element (25) having a major surface (27) exposed and at least one peripheral portion (36) extending outwards from at least one side of the plastic case (2), of the type wherein it provides for forming the plastic case (2) of the package by molding inside a main cavity (24) of a mold (23) after positioning the heat sink element (25) with this major surface (27) in contact with the bottom of a suitable housing (26) provided in a lower portion of the mold (23) which opens into the main cavity (24) of the mold. According to the invention, the following steps are provided: forming the heat sink element (25) such that at least side surfaces (29) jutting out of said side of the plastic case (2) are, at least in a zone adjacent to that side and in the peripheral portion (36), inclined to form an angle ( alpha ) substantially greater than zero with a normal line (N) to the major surface (27), so as to have a negative slope from outside; correspondingly forming the housing (26) such that its inner walls (28) facing said side surfaces (29) of the heat sink element are inclined, at least in that zone, to form an angle substantially equal to the angle ( alpha ) with the normal line (N), with a positive slope from the housing interior; and providing thrust means (30) which, when the mold (23) is closed, are engaged from above with at least part of the peripheral portion (36) of the heat sink element (25) to exert thereon a compressive force substantially toward the housing (26) bottom and which is effective to hermetically seal temporarily the side surfaces (29) of the heat sink element and the inner walls (28) of the housing in the zone adjacent to said side of the plastic case.

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