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    DEVIATED END MOLD FOR PLASTIC PACKAGE OF INTEGRATED SEMICONDUCTOR DEVICE
    2.
    发明专利
    DEVIATED END MOLD FOR PLASTIC PACKAGE OF INTEGRATED SEMICONDUCTOR DEVICE 失效

    公开(公告)号：JP2001047473A

    公开(公告)日：2001-02-20

    申请号：JP2000236792

    申请日：2000-08-04

    Applicant: ST MICROELECTRONICS SRL

    Inventor： POINELLI RENATO ,  MAZZOLA MAURO ,  BRIOSCHI ROBERTO

    IPC: B29C45/26 ,  B29C45/14 ,  H01L21/56

    Abstract: PROBLEM TO BE SOLVED: To completely fill a resin in a cavity and to prevent a flash at a molding by deviating an inside end of an upper side half mold for forming a mold to an inside with respect to an inside end of a lower side half mold, and cooperating a spoiler of a lead frame to limit an opening dimension of a slit. SOLUTION: A semiconductor die 1 is assembled on a depressed central pad 2 of a lead frame 3 made of a metal, and sealed in a cavity 6 formed of both upper and lower half molds 4 and 5. Then, a slit 7 is formed at adjacent parts to the pad 2 and the frame 3, and a resin is charged in the cavity 6 from the slit 7. That is, one end 8 of the pad 2 is bent upward to form a deflecting plate and a spoiler, and the slit 7 is formed. An inside end of the mold 4 is deviated to the inside with respect to the inside end of the mold 5, and when the molds 4, 5 are connected, a size of the slit 7 is reduced. Thus, the resin can be completely charge din the cavity 6.

    3.
    发明专利
    未知

    公开(公告)号：DE69620564T2

    公开(公告)日：2003-01-30

    申请号：DE69620564

    申请日：1996-01-25

    Applicant: ST MICROELECTRONICS SRL

    Inventor： POINELLI RENATO ,  MAZZOLA MAURO

    IPC: H01L23/50 ,  H01L21/673 ,  H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34

    Abstract: A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate (2) that is arranged on the bottom of the plastic package and has thinner ends (2'); its particularity is that the length (LH) of the heat sink plate is at least equal to the minimum length (Lp) of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

    8.
    发明专利
    未知

    公开(公告)号：DE69620564D1

    公开(公告)日：2002-05-16

    申请号：DE69620564

    申请日：1996-01-25

    Applicant: ST MICROELECTRONICS SRL

    Inventor： POINELLI RENATO ,  MAZZOLA MAURO

    IPC: H01L23/50 ,  H01L21/673 ,  H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34

    Abstract: A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate (2) that is arranged on the bottom of the plastic package and has thinner ends (2'); its particularity is that the length (LH) of the heat sink plate is at least equal to the minimum length (Lp) of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

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