公开(公告)号：WO2005104223A8

公开(公告)日：2006-11-23

申请号：PCT/EP2005051694

申请日：2005-04-18

Applicant: ST MICROELECTRONICS SRL ,  PONZA ANNA ,  DEPETRO RICCARDO ,  MONTANINI PIETRO

Inventor： PONZA ANNA ,  DEPETRO RICCARDO ,  MONTANINI PIETRO

IPC: H01L21/78

CPC classification number: H01L21/78

Abstract: A process for the fabrication of an integrated device in a semiconductor chip envisages: forming a semiconductor layer (5') partially suspended above a semiconductor substrate (2) and constrained to the substrate (2) by temporary anchorages (10, 15'); dividing the layer (5') into a plurality of portions (13) laterally separated from one another; and removing the temporary anchorages (10, 15'; 38), in order to free the portions (13).

Abstract translation: 用于制造半导体芯片中的集成器件的方法设想：形成半导体衬底（2）部分悬置并通过临时固定（10,15'）约束到衬底（2）的半导体层（5'）; 将层（5'）分成彼此横向分离的多个部分（13）; 以及移除所述临时锚固件（10,15'; 38），以便释放所述部分（13）。

公开(公告)号：ITTO20040244A1

公开(公告)日：2004-07-20

申请号：ITTO20040244

申请日：2004-04-20

Applicant: ST MICROELECTRONICS SRL

Inventor： DEPETRO RICCARDO ,  MONTANINI PIETRO ,  PONZA ANNA

IPC: H01L21/78