公开(公告)号：ITVA980019D0

公开(公告)日：1998-08-07

申请号：ITVA980019

申请日：1998-08-07

Applicant: ST MICROELECTRONICS SRL

Inventor： RENARD LOCI ,  VITALI BATTISTA

IPC: B23K20/00 ,  H01L21/60

公开(公告)号：IT201700071775A1

公开(公告)日：2018-12-27

申请号：IT201700071775

申请日：2017-06-27

Applicant: ST MICROELECTRONICS SRL

Inventor： MAZZOLA MAURO ,  DE SANTA MATTEO ,  VITALI BATTISTA

IPC: H01L23/495

公开(公告)号：ITMI20000791A1

公开(公告)日：2001-10-11

申请号：ITMI20000791

申请日：2000-04-11

Applicant: ST MICROELECTRONICS SRL

Inventor： VITALI BATTISTA ,  FRONTERO ALESSANDRO

IPC: B23K20/00 ,  H01L21/607

Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated includes a body whose terminal portion is substantially frustum-shaped. The body has a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device. The portion of the body that is adjacent a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allows formation of a substantially flat annular peripheral region on a copper ball when the copper ball is placed at a lower end of the copper wire. The copper ball is deformed by the action of the capillary. The formation of the substantially flat annular peripheral region is independent of the position of the copper wire within the through hole of the body of the capillary.

公开(公告)号：ITVA980019A1

公开(公告)日：2000-02-07

申请号：ITVA980019

申请日：1998-08-07

Applicant: ST MICROELECTRONICS SRL

Inventor： RENARD LOCI ,  VITALI BATTISTA

IPC: B23K20/00 ,  H01L21/60

公开(公告)号：IT1317214B1

公开(公告)日：2003-05-27

申请号：ITMI20000791

申请日：2000-04-11

Applicant: ST MICROELECTRONICS SRL

Inventor： VITALI BATTISTA ,  FRONTERO ALESSANDRO

IPC: B23K20/00 ,  H01L21/607

Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated includes a body whose terminal portion is substantially frustum-shaped. The body has a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device. The portion of the body that is adjacent a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allows formation of a substantially flat annular peripheral region on a copper ball when the copper ball is placed at a lower end of the copper wire. The copper ball is deformed by the action of the capillary. The formation of the substantially flat annular peripheral region is independent of the position of the copper wire within the through hole of the body of the capillary.

公开(公告)号：IT1305646B1

公开(公告)日：2001-05-15

申请号：ITVA980019

申请日：1998-08-07

Applicant: ST MICROELECTRONICS SRL

Inventor： RENARD LOCI ,  VITALI BATTISTA

IPC: B23K20/00 ,  H01L21/60

公开(公告)号：ITMI20000791D0

公开(公告)日：2000-04-11

申请号：ITMI20000791

申请日：2000-04-11

Applicant: ST MICROELECTRONICS SRL

Inventor： VITALI BATTISTA ,  FRONTERO ALESSANDRO

IPC: B23K20/00 ,  H01L21/607

Abstract: A capillary for electrical bonding between a semiconductor chip and corresponding pins of a semiconductor device in which the chip is accommodated includes a body whose terminal portion is substantially frustum-shaped. The body has a diametrical through hole which allows the passage of a copper wire for electrical bonding between the chip and the semiconductor device. The portion of the body that is adjacent a lower end of the through hole is flared, with a flaring diameter and a flaring angle which allows formation of a substantially flat annular peripheral region on a copper ball when the copper ball is placed at a lower end of the copper wire. The copper ball is deformed by the action of the capillary. The formation of the substantially flat annular peripheral region is independent of the position of the copper wire within the through hole of the body of the capillary.