公开(公告)号：WO2015038757A1

公开(公告)日：2015-03-19

申请号：PCT/US2014/055169

申请日：2014-09-11

Applicant: STARKEY LABORATORIES, INC.

Inventor： LINK, Douglas F. ,  VANG, Ay ,  DZARNOSKI, John ,  LAMBERT, Andy ,  SPLETTSTOESZER, Dale ,  KRZMARZICK, Susie ,  PRCHAL, David ,  SUN, Kexia ,  XING, Yangjun

IPC: H04R25/00

CPC classification number: H04R25/65 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/19106 ,  H04R25/60 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/10674 ,  Y10T29/49005

Abstract: Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a flexible circuit substrate and an integrated circuit die embedded within the flexible circuit substrate. The integrated circuit die includes a digital signal processor (DSP) die, in an embodiment. In various embodiments, the DSP die includes a DSP configured to provide processing for the hearing assistance device.

Abstract translation: 这里公开的是用于改善听力辅助装置的电路设计的系统和方法。 本主题的一个方面包括被配置为补偿用户的听力损失的助听装置。 助听装置包括柔性电路基板和嵌入在柔性电路基板内的集成电路管芯。 在一个实施例中，集成电路管芯包括数字信号处理器（DSP）管芯。 在各种实施例中，DSP管芯包括被配置为为助听器件提供处理的DSP。

公开(公告)号：EP3044971A1

公开(公告)日：2016-07-20

申请号：EP14772534.5

申请日：2014-09-11

Applicant: Starkey Laboratories, Inc.

Inventor： LINK, Douglas F. ,  VANG, Ay ,  DZARNOSKI, John ,  LAMBERT, Andy ,  SPLETTSTOESZER, Dale ,  KRZMARZICK, Susie ,  PRCHAL, David ,  SUN, Kexia ,  XING, Yangjun

IPC: H04R25/00

CPC classification number: H04R25/65 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19105 ,  H01L2924/19106 ,  H04R25/60 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/10674 ,  Y10T29/49005

Abstract: Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a flexible circuit substrate and an integrated circuit die embedded within the flexible circuit substrate. The integrated circuit die includes a digital signal processor (DSP) die, in an embodiment. In various embodiments, the DSP die includes a DSP configured to provide processing for the hearing assistance device.

Abstract translation: 披露，除其他事项外，对于助听设备的系统和改进的电路设计方法。 的本主题的一个方面包括配置为补偿听力的用户的损失助听装置。 该助听装置包括：柔性电路衬底，并嵌入柔性电路衬底内的集成电路。 该集成电路包括一个数字信号处理器（DSP），该实施例本身。 在各种实施例，其中包括一个DSP构成的DSP为助听设备提供的处理。