公开(公告)号：EP0148601A3

公开(公告)日：1986-07-30

申请号：EP84308598

申请日：1984-12-11

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Fisher, Paul David ,  Manocchi, James Charles

IPC: H05K03/20

CPC classification number: H05K3/046 ,  H05K3/386 ,  H05K2203/0156 ,  H05K2203/0522 ,  H05K2203/0528

Abstract: Electrical circuit patterns are adhesively bonded to a dielectric support (e.g., epoxy glass prepreg) by using a transfer laminate. The transfer laminate comprises a release coated carrier film, a metallic layer and an adhesive. After being bonded to the support, the carrier film is stripped therefrom to leave portions of the metal in the form of the conductive pathways of the circuit, adhesively bonded to the support. in fig. 1 a transfer laminate consists of a carrier film 11, a release coating 12, an adherent metal layer 13 on the other side of the release coating and an adhesive pattern 14 which is in the shape of the ultimate desired circuit pattern.

公开(公告)号：EP0148602A3

公开(公告)日：1986-07-30

申请号：EP84308599

申请日：1984-12-11

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Fisher, Paul David ,  Panza, Robert Alan

IPC: H05K03/02 ,  B32B15/08

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B27/32 ,  B32B27/36 ,  B32B2255/10 ,  H05K3/025 ,  H05K3/386 ,  H05K2201/0162 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0156

Abstract: Conductive metallic layers which are substantially continuous and pin hole free are adhesively bonded to a dielectric support (e.g. epoxy glass prepreg) by using a transfer laminate. The transfer laminate comprises a release coated carrier film, a metallic layer and an adhesive. After being bonded to the support, the carrier film is stripped therefrom to bond the metallic layer to the support. In fig. 1 a transfer laminate comprises a carrier film 11, a release coating 12 bonded to one side of the carrier film, an adherent metal layer 13, and an adhesive layer 14.

公开(公告)号：EP0148602A2

公开(公告)日：1985-07-17

申请号：EP84308599.4

申请日：1984-12-11

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Fisher, Paul David ,  Panza, Robert Alan

IPC: H05K3/02 ,  B32B15/08

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B27/32 ,  B32B27/36 ,  B32B2255/10 ,  H05K3/025 ,  H05K3/386 ,  H05K2201/0162 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0156

Abstract: Conductive metallic layers which are substantially continuous and pin hole free are adhesively bonded to a dielectric support (e.g. epoxy glass prepreg) by using a transfer laminate. The transfer laminate comprises a release coated carrier film, a metallic layer and an adhesive. After being bonded to the support, the carrier film is stripped therefrom to bond the metallic layer to the support. In fig. 1 a transfer laminate comprises a carrier film 11, a release coating 12 bonded to one side of the carrier film, an adherent metal layer 13, and an adhesive layer 14.

Abstract translation: 基本上连续且无针孔的导电性金属层通过使用转印层压体粘接到电介质载体（例如环氧玻璃预浸料）上。 转印层压板包括脱模涂层载体膜，金属层和粘合剂。 在粘合到载体上之后，将载体膜剥离，从而将金属层粘合到载体上。 在图中 如图1所示，转印层压板包括载体膜11，粘合到载体膜的一侧的剥离涂层12，粘附金属层13和粘合剂层14。

公开(公告)号：EP0148601A2

公开(公告)日：1985-07-17

申请号：EP84308598.6

申请日：1984-12-11

Applicant: STAUFFER CHEMICAL COMPANY

Inventor： Fisher, Paul David ,  Manocchi, James Charles

IPC: H05K3/20

CPC classification number: H05K3/046 ,  H05K3/386 ,  H05K2203/0156 ,  H05K2203/0522 ,  H05K2203/0528

Abstract: Electrical circuit patterns are adhesively bonded to a dielectric support (e.g., epoxy glass prepreg) by using a transfer laminate. The transfer laminate comprises a release coated carrier film, a metallic layer and an adhesive. After being bonded to the support, the carrier film is stripped therefrom to leave portions of the metal in the form of the conductive pathways of the circuit, adhesively bonded to the support. in fig. 1 a transfer laminate consists of a carrier film 11, a release coating 12, an adherent metal layer 13 on the other side of the release coating and an adhesive pattern 14 which is in the shape of the ultimate desired circuit pattern.

Abstract translation: 通过使用转印层压体将电路图案粘合到电介质载体（例如，环氧玻璃预浸料）上。 转印层压板包括脱模涂层载体膜，金属层和粘合剂。 在粘合到载体上之后，从其中剥离载体膜，以使电路的导电通路形式的部分金属粘合到载体上。 转印层压体由承载膜11，剥离涂层12，剥离涂层的另一侧上的粘附金属层13和具有最终期望的电路图案形状的粘合剂图案14组成。